MT48H16M32LFCM-75 IT:A TR Micron Technology Inc, MT48H16M32LFCM-75 IT:A TR Datasheet - Page 73

• Manufacturer Part Number: MT48H16M32LFCM-75 IT:A TR
• Description: IC SDRAM 512MBIT 133MHZ 90VFBGA
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H16M32LFCM-75 IT:A TR

• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 512M (16M x 32)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 90-VFBGA
• Organization: 16Mx32
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 8/5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 95mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1329-2

Figure 56:
PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03
MT48H32M16LF_1.fm - Rev. J 2/08 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
Dimensions apply
to solder balls post
reflow. The pre-
reflow balls are
Ø0.42 on Ø0.40
SMD ball pads.
for production devices. Although considered final, these specifications are subject to change, as further product
11.2
Seating
90X Ø0.45
plane
0.1 A
0.8 TYP
90-Ball VFBGA (10mm x 13mm)
5.6
Notes:
A
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
9 8
1. All dimensions are in millimeters.
2. Green packaging composition is available upon request.
3.2
7
development and data characterization sometimes occur.
10 ±0.1
6.4
5 ±0.05
3 2
1
their respective owners.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
0.8 TYP
512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
6.5 ±0.05
0.65 ±0.05
Ball A1 ID
73
13 ±0.1
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.0 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
©2005 Micron Technology, Inc. All rights reserved.
Ball A1 ID