SE97TP,147 NXP Semiconductors, SE97TP,147 Datasheet - Page 36

• Manufacturer Part Number: SE97TP,147
• Description: IC TEMP SENSOR DIMM 8-HWSON
• Manufacturer: NXP Semiconductors

Specifications of SE97TP,147

• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Comparator, Register Bank
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 125°C
• Output Type: I²C™/SMBus™
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-WSON (Exposed Pad), 8-HWSON
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4730-2; 935286725147

NXP Semiconductors
SE97_7
Product data sheet
9.1 SE97 in memory module application
9.2 Layout consideration
9.3 Thermal considerations
Figure 25
centered in the memory module to monitor the temperature of the DRAM and also to
provide a 2-kbit EEPROM as the Serial Presence Detect (SPD). In the event of
overheating, the SE97 triggers the EVENT output and the memory controller throttles the
memory bus to slow the DRAM. The memory controller can also read the SE97 and watch
the DRAM thermal behavior, taking preventive measures when necessary.
The SE97 does not require any additional components other than the host controller to
read its temperature. It is recommended that a 0.1 μF bypass capacitor between the V
and V
protection.
In general, self-heating is the result of power consumption and not a concern, especially
with the SE97, which consumes very low power. In the event the SDA and EVENT pins
are heavily loaded with small pull-up resistor values, self-heating affects temperature
accuracy by approximately 0.5 °C.
Equation 1
where:
ΔT
[
Fig 25. System application
(
ΔT = T
T
T
R
V
I
DD(AV)
V
j
amb
DD
th(j-a)
DD
= junction temperature
=
SS
= supply voltage
R
= ambient temperature
×
th j-a
j
= package thermal resistance
pins is located as close as possible to the power and ground pins for noise
= average supply current
I
− T
DD AV
shows the SE97 being placed in the memory module application. The SE97 is
(
is the formula to calculate the effect of self-heating:
(
amb
)
DIMM
×
)
DRAM
)
+
(
V
Rev. 07 — 29 January 2010
OL SDA
DDR memory module temp sensor with integrated SPD, 3.3 V
MEMORY CONTROLLER
(
)
DRAM
×
I
OL
(
SMBus
sin
k
) SDA
(
SE97
)
)
+
(
V
OL EVENT
EVENT
(
DRAM
)
×
I
OL
(
sin
k
DRAM
)EVENT
CPU
002aac800
© NXP B.V. 2010. All rights reserved.
)
]
SE97
36 of 55
DD
(1)