SE97TP,147 NXP Semiconductors, SE97TP,147 Datasheet - Page 52

IC TEMP SENSOR DIMM 8-HWSON

SE97TP,147

Manufacturer Part Number
SE97TP,147
Description
IC TEMP SENSOR DIMM 8-HWSON
Manufacturer
NXP Semiconductors
Datasheet

Specifications of SE97TP,147

Function
Temp Monitoring System (Sensor)
Topology
ADC (Sigma Delta), Comparator, Register Bank
Sensor Type
Internal
Sensing Temperature
-40°C ~ 125°C
Output Type
I²C™/SMBus™
Output Alarm
Yes
Output Fan
Yes
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-WSON (Exposed Pad), 8-HWSON
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-4730-2
935286725147
NXP Semiconductors
14. Abbreviations
SE97_7
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Table 33.
Acronym
ADC
ARA
CDM
CMOS
CPU
DDR
DIMM
DRAM
ECC
EEPROM
ESD
HBM
I
LSB
MM
MSB
PC
PCB
POR
2
Fig 46. Temperature profiles for large and small components
C-bus
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Analog-to-Digital Converter
Alert Response Address
Charged-Device Model
Complementary Metal-Oxide Semiconductor
Central Processing Unit
Double Data Rate
Dual In-line Memory Module
Dynamic Random Access Memory
Error-Correcting Code
Electrically Erasable Programmable Read-Only Memory
ElectroStatic Discharge
Human Body Model
Inter-Integrated Circuit bus
Least Significant Bit
Machine Model
Most Significant Bit
Personal Computer
Printed-Circuit Board
Power-On Reset
Rev. 07 — 29 January 2010
DDR memory module temp sensor with integrated SPD, 3.3 V
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
temperature
peak
© NXP B.V. 2010. All rights reserved.
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time
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