ATEVK1104 Atmel, ATEVK1104 Datasheet - Page 73

KIT DEV/EVAL FOR AVR32 AT32UC3A

ATEVK1104

Manufacturer Part Number
ATEVK1104
Description
KIT DEV/EVAL FOR AVR32 AT32UC3A
Manufacturer
Atmel
Series
AVR®32r
Type
MCUr
Datasheets

Specifications of ATEVK1104

Contents
Evaluation Board, Software and Documentation
Processor To Be Evaluated
AT32UC3A3
Data Bus Width
32 bit
Interface Type
USB, SPI, USART
Silicon Manufacturer
Atmel
Core Architecture
AVR
Core Sub-architecture
AVR UC3
Silicon Core Number
AT32UC3A3256
Silicon Family Name
AVR
Kit Contents
Board CD Docs
Rohs Compliant
Yes
For Use With/related Products
AT32UC3A3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATEVK1104
Manufacturer:
Atmel
Quantity:
135
11. Mechanical Characteristics
11.1
11.1.1
11.1.2
32072C–AVR32–2010/03
Thermal Considerations
Thermal Data
Junction Temperature
Table 11-1
Table 11-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
JA
JC
page
Table 11-1 on page
characteristics” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
73.
=
T
summarizes the thermal resistance data depending on the package.
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
73.
JA
)
49.
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Still Air
TFBGA144
TFBGA144
VFBGA100
VFBGA100
TQFP144
TQFP144
Package
AT32UC3A3/A4
Table 11-1 on
40.3
28.5
31.1
Typ
9.5
6.9
6.9
”Regulator
J
°C/W
°C/W
°C/W
in °C.
Unit
73

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