XE8000EV101 Semtech, XE8000EV101 Datasheet - Page 133
XE8000EV101
Manufacturer Part Number
XE8000EV101
Description
EVAL BOARD FOR XE8801AMI027LF
Manufacturer
Semtech
Type
MCUr
Specifications of XE8000EV101
Contents
Fully Assembled Evaluation Board
For Use With/related Products
XE88LC01AMI027
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
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20.1 LQFP type package
The QFP package dimensions are given in Figure 20-1 and Table 20-1. The dimensions conform to JEDEC MS-
026 Rev. C.
Figure 20-1. QFP type package
package
LQFP-44
Table 20-1. QFP package dimensions
20.2 Die XE8801AM
The XE8801AM die is 4100 x 4600 um
left corner of pad ring. Pad opening is 85x85 um
© Semtech 2005
pin name
PA(4)
PA(5)
PA(6)
PA(7)
PC(0)
PC(1)
PC(2)
PC(3)
PC(4)
PC(5)
PC(6)
PC(7)
PB(0)
VBat
VSS
10.0
bottom pads
mm
A
left pads
12.0
pin X
[um]
398
mm
52
52
52
52
52
52
52
52
52
52
52
52
52
52
B
1.4
mm
C
pin Y
4075
3795
3515
3235
2955
2675
2395
2115
1835
1555
1275
[um]
995
715
435
47
2
0.10
mm
large plus 20-30 um due to the saw channel. Zero coordinate is at bottom
D
2
pin name
OSCOUT
0.37
. Pad surface is xxx.
VMULT
RESET
OSCIN
mm
VREG
PA(3)
PA(2)
PA(1)
PA(0)
VBAT
E
VSS
VSS
VSS
20-2
0.8
mm
F
right pads
top pads
pin X
1212
1477
1742
2007
2537
2802
3067
3332
3597
3958
[um]
417
682
947
mm
G
pin Y
4453
4453
4453
4453
4453
4453
4453
4453
4453
4453
4453
4453
3942
[um]
XE8801A – SX8801R
www.semtech.com
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