PIC18F1320-I/SO Microchip Technology, PIC18F1320-I/SO Datasheet - Page 222

IC MCU FLASH 4KX16 A/D 18SOIC

PIC18F1320-I/SO

Manufacturer Part Number
PIC18F1320-I/SO
Description
IC MCU FLASH 4KX16 A/D 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F1320-I/SO

Program Memory Type
FLASH
Program Memory Size
8KB (4K x 16)
Package / Case
18-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
16
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163014, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
7-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F1320-I/SO
Manufacturer:
MICROCHIP
Quantity:
35 000
Part Number:
PIC18F1320-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC18F1220/1320
POP
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
DS39605C-page 220
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
Stack (1 level down)
TOS
PC
Q1
operation
Pop Top of Return Stack
[ label ]
None
(TOS)
None
The TOS value is pulled off the
return stack and is discarded. The
TOS value then becomes the
previous value that was pushed
onto the return stack.
This instruction is provided to
enable the user to properly manage
the return stack to incorporate a
software stack.
1
1
POP
GOTO
0000
Q2
No
bit bucket
POP
0000
NEW
=
=
=
=
Pop TOS
value
Q3
0x0031A2
0x014332
0x014332
NEW
0000
operation
Q4
No
0110
PUSH
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
PC
PC
TOS
Stack (1 level down)
Q1
PC + 2 onto
return stack
Push Top of Return Stack
[ label ]
None
(PC + 2)
None
The PC + 2 is pushed onto the top
of the return stack. The previous
TOS value is pushed down on the
stack.
This instruction allows implement-
ing a software stack by modifying
TOS and then pushing it onto the
return stack.
1
1
PUSH
Push
0000
Q2
 2004 Microchip Technology Inc.
PUSH
0000
TOS
=
=
=
=
=
operation
Q3
No
0x00345A
0x000124
0x000126
0x000126
0x00345A
0000
operation
Q4
No
0101

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