PIC18F1320-I/SO Microchip Technology, PIC18F1320-I/SO Datasheet - Page 30

IC MCU FLASH 4KX16 A/D 18SOIC

PIC18F1320-I/SO

Manufacturer Part Number
PIC18F1320-I/SO
Description
IC MCU FLASH 4KX16 A/D 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F1320-I/SO

Program Memory Type
FLASH
Program Memory Size
8KB (4K x 16)
Package / Case
18-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
16
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163014, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
7-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F1320-I/SO
Manufacturer:
MICROCHIP
Quantity:
35 000
Part Number:
PIC18F1320-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC18F1220/1320
3.4.4
An exit from a power managed Run mode to its
corresponding Idle mode is executed by setting the
IDLEN bit and executing a SLEEP instruction. The CPU
is halted at the beginning of the instruction following the
SLEEP instruction. There are no changes to any of the
clock source status bits (OSTS, IOFS or T1RUN).
While the CPU is halted, the peripherals continue to be
clocked from the previously selected clock source.
3.4.5
An exit from a power managed Run mode to Sleep
mode is executed by clearing the IDLEN and
SCS1:SCS0 bits and executing a SLEEP instruction.
The code is no different than the method used to invoke
Sleep mode from the normal operating (full power)
mode.
The primary clock and internal oscillator block are
disabled. The INTRC will continue to operate if the
WDT is enabled. The Timer1 oscillator will continue to
run, if enabled in the T1CON register (Register 12-1).
All clock source status bits are cleared (OSTS, IOFS
and T1RUN).
DS39605C-page 28
EXIT TO IDLE MODE
EXIT TO SLEEP MODE
3.5
An exit from any of the power managed modes is trig-
gered by an interrupt, a Reset or a WDT time-out. This
section discusses the triggers that cause exits from
power managed modes. The clocking subsystem
actions are discussed in each of the power managed
modes (see Sections 3.2 through 3.4).
Device behavior during Low-Power mode exits is
summarized in Table 3-3.
3.5.1
Any of the available interrupt sources can cause the
device to exit a power managed mode and resume full
power operation. To enable this functionality, an inter-
rupt source must be enabled by setting its enable bit in
one of the INTCON or PIE registers. The exit sequence
is initiated when the corresponding interrupt flag bit is
set. On all exits from Low-Power mode by interrupt,
code execution branches to the interrupt vector if the
GIE/GIEH bit (INTCON<7>) is set. Otherwise, code
execution continues or resumes without branching
(see Section 9.0 “Interrupts”).
Note:
Wake from Power Managed Modes
If application code is timing sensitive, it
should wait for the OSTS bit to become set
before continuing. Use the interval during
the low-power exit sequence (before
OSTS is set) to perform timing insensitive
“housekeeping” tasks.
EXIT BY INTERRUPT
 2004 Microchip Technology Inc.

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