PIC18F1320-I/SO Microchip Technology, PIC18F1320-I/SO Datasheet - Page 5

• Manufacturer Part Number: PIC18F1320-I/SO
• Description: IC MCU FLASH 4KX16 A/D 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F1320-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 8KB (4K x 16)
• Package / Case: 18-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 16
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 7x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: EUSART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163014, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 7-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ..................................................................................................................................................................................... 87
11.0 Timer0 Module ........................................................................................................................................................................... 99
12.0 Timer1 Module ......................................................................................................................................................................... 103
13.0 Timer2 Module ......................................................................................................................................................................... 109
14.0 Timer3 Module ......................................................................................................................................................................... 111
15.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 115
16.0 Enhanced Addressable Universal Synchronous Asynchronous Receiver Transmitter (EUSART) .......................................... 131
17.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 155
18.0 Low-Voltage Detect .................................................................................................................................................................. 165
19.0 Special Features of the CPU.................................................................................................................................................... 171
20.0 Instruction Set Summary .......................................................................................................................................................... 191
21.0 Development Support............................................................................................................................................................... 233
22.0 Electrical Characteristics .......................................................................................................................................................... 239
23.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 269
24.0 Packaging Information.............................................................................................................................................................. 287
Appendix A: Revision History............................................................................................................................................................. 293
Appendix B: Device Differences ........................................................................................................................................................ 293
Appendix C: Conversion Considerations ........................................................................................................................................... 294
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 294
Appendix E: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 295
Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................. 295
Index .................................................................................................................................................................................................. 297
On-Line Support................................................................................................................................................................................. 305
Systems Information and Upgrade Hot Line ...................................................................................................................................... 305
Reader Response .............................................................................................................................................................................. 306
PIC18F1220/1320 Product Identification System .............................................................................................................................. 307
 2004 Microchip Technology Inc.
Device Overview .......................................................................................................................................................................... 5
Oscillator Configurations ............................................................................................................................................................ 11
Power Managed Modes ............................................................................................................................................................. 19
Reset .......................................................................................................................................................................................... 33
Memory Organization ................................................................................................................................................................. 41
Flash Program Memory.............................................................................................................................................................. 57
Data EEPROM Memory ............................................................................................................................................................. 67
8 x 8 Hardware Multiplier............................................................................................................................................................ 71
Interrupts .................................................................................................................................................................................... 73
PIC18F1220/1320
DS39605C-page 3