MC68HC908JB8JPE Freescale Semiconductor, MC68HC908JB8JPE Datasheet - Page 266

• Manufacturer Part Number: MC68HC908JB8JPE
• Description: IC MCU FLASH 8BIT 8K 20-DIP
• Manufacturer: Freescale Semiconductor
• Series: HC08r

Specifications of MC68HC908JB8JPE

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 3MHz
• Connectivity: USB
• Peripherals: LVD, POR, PWM
• Number Of I /o: 13
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 20-DIP (0.300", 7.62mm)
• Controller Family/series: HC08
• No. Of I/o's: 13
• Ram Memory Size: 256Byte
• Cpu Speed: 3MHz
• No. Of Timers: 1
• Embedded Interface Type: USB
• Rohs Compliant: Yes
• Processor Series: HC08JB
• Core: HC08
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: USB
• Maximum Clock Frequency: 3 MHz
• Number Of Programmable I/os: 37
• Number Of Timers: 2
• Operating Supply Voltage: 4 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: Through Hole
• Development Tools By Supplier: FSICEBASE, DEMO908GZ60E, M68EML08GZE, KITUSBSPIDGLEVME, KITUSBSPIEVME, KIT33810EKEVME
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

Mechanical Specifications
19.6 20-Pin Small Outline Integrated Circuit (SOIC)
Technical Data
266
20
1
20X
18X
0.010 (0.25)
–A–
D
G
M
T
A
11
10
Figure 19-4. 20-Pin SOIC (Case 751D)
–B–
S
K
C
B
S
10X
–T–
P
Mechanical Specifications
0.010 (0.25)
SEATING
PLANE
J
F
MC68HC908JB8•MC68HC08JB8•MC68HC08JT8 — Rev. 2.3
M
B
M
M
R
X 45
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.150
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
(0.006) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
DIM
A
B
C
D
G
K
M
P
R
F
J
12.65
10.05
MILLIMETERS
Freescale Semiconductor
MIN
7.40
2.35
0.35
0.50
0.25
0.10
0.25
1.27 BSC
0
12.95
10.55
MAX
7.60
2.65
0.49
0.90
0.32
0.25
0.75
7
0.499
0.292
0.093
0.014
0.020
0.010
0.004
0.395
0.010
MIN
0.050 BSC
0
INCHES
MAX
0.510
0.299
0.104
0.019
0.035
0.012
0.009
0.415
0.029
7