MC68HC908JB8JPE Freescale Semiconductor, MC68HC908JB8JPE Datasheet - Page 53

• Manufacturer Part Number: MC68HC908JB8JPE
• Description: IC MCU FLASH 8BIT 8K 20-DIP
• Manufacturer: Freescale Semiconductor
• Series: HC08r

Specifications of MC68HC908JB8JPE

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 3MHz
• Connectivity: USB
• Peripherals: LVD, POR, PWM
• Number Of I /o: 13
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 20-DIP (0.300", 7.62mm)
• Controller Family/series: HC08
• No. Of I/o's: 13
• Ram Memory Size: 256Byte
• Cpu Speed: 3MHz
• No. Of Timers: 1
• Embedded Interface Type: USB
• Rohs Compliant: Yes
• Processor Series: HC08JB
• Core: HC08
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: USB
• Maximum Clock Frequency: 3 MHz
• Number Of Programmable I/os: 37
• Number Of Timers: 2
• Operating Supply Voltage: 4 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: Through Hole
• Development Tools By Supplier: FSICEBASE, DEMO908GZ60E, M68EML08GZE, KITUSBSPIDGLEVME, KITUSBSPIEVME, KIT33810EKEVME
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

Technical Data — MC68HC908JB8•MC68HC08JB8•MC68HC08JT8
4.1 Contents
4.2 Introduction
MC68HC908JB8•MC68HC08JB8•MC68HC08JT8 — Rev. 2.3
Freescale Semiconductor
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.8.1
4.9
4.9.1
4.9.2
4.9.3
4.9.4
This section describes the operation of the embedded FLASH memory.
This memory can be read, programmed, and erased from a single
external supply. The program and erase operations are enabled through
the use of an internal charge pump.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
FLASH Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
FLASH Block Erase Operation . . . . . . . . . . . . . . . . . . . . . . . . . 56
FLASH Mass Erase Operation . . . . . . . . . . . . . . . . . . . . . . . . . 57
FLASH Program Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . .58
FLASH Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
ROM-Resident Routines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
FLASH Block Protect Register . . . . . . . . . . . . . . . . . . . . . . . 60
Variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
ERASE Routine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
PROGRAM Routine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
VERIFY Routine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
FLASH Memory
Section 4. FLASH Memory
Technical Data
53