C8051F902-GU Silicon Laboratories Inc, C8051F902-GU Datasheet - Page 163

• Manufacturer Part Number: C8051F902-GU
• Description: IC MCU 8BIT 8KB FLASH 24QSOP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F9xxr

Specifications of C8051F902-GU

• Program Memory Type: FLASH
• Program Memory Size: 8KB (8K x 8)
• Package / Case: 24-QSOP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 16
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 0.9 V ~ 3.6 V
• Data Converters: A/D 15x10/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F9x
• Core: 8051
• Data Ram Size: 768 B
• Interface Type: UART
• Maximum Clock Frequency: 25 MHz
• Number Of Timers: 4
• Operating Supply Voltage: 0.9 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F912DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit
• Package: 24QSOP
• Device Core: 8051
• Family Name: C8051F90x
• Maximum Speed: 25 MHz
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 16
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1849-5

16.4. Enabling the DC-DC Converter
On power-on reset, the state of the DCEN pin is sampled to determine if the device will power up in one-
cell or two-cell mode. In two-cell mode, the dc-dc converter always remains disabled. In one-cell mode, the
dc-dc converter remains disabled in Sleep Mode, and enabled in all other power modes. See Section
“14. Power Management” on page 143 for complete details on available power modes.
The dc-dc converter is enabled (one-cell mode) in hardware by placing a 0.68 µH inductor between DCEN
and VBAT. The dc-dc converter is disabled (two-cell mode) by shorting DCEN directly to GND. The DCEN
pin should never be left floating. The device can only switch between one-cell and two-cell mode during a
power-on reset. See Section “18. Reset Sources” on page 171 for more information regarding reset behav-
ior.
Figure 16.2 shows the two dc-dc converter configuration options.
When the dc-dc converter “Enabled” configuration (one-cell mode) is chosen, the following guidelines
apply:
•
•
•
•
•
DC-DC Converter
Enabled
0.9 to 3.6 V (‘F912/02)
0.9 to 1.8 V (‘F911/01)
Supply Voltage
(one-cell mode)
DC-DC Converter
Disabled
1.8 to 3.6 V 
Supply Voltage
(two-cell mode)
In most cases, the GND/DC– pin should not be externally connected to GND.
The 0.68 µH inductor should be placed as close as possible to the DCEN pin for maximum efficiency.
The 4.7 µF capacitor should be placed as close as possible to the inductor.
The current loop including GND, the 4.7 µF capacitor, the 0.68 µH inductor and the DCEN pin should
be made as short as possible.
The PCB traces connecting VDD/DC+ to the output capacitor and the output capacitor to GND/DC–
should be as short and as thick as possible in order to minimize parasitic inductance.
Figure 16.2. DC-DC Converter Configuration Options
VBAT
VBAT
Rev. 1.0
4.7 uF
C8051F91x-C8051F90x
GND
GND
0.68 uH
DCEN
DCEN
VDD/DC+
VDD/DC+
GND/DC-
GND/DC-
1uF
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