MCIMX512CJM6C Freescale Semiconductor, MCIMX512CJM6C Datasheet - Page 35

MULTIMEDIA PROC 529-LFBGA

MCIMX512CJM6C

Manufacturer Part Number
MCIMX512CJM6C
Description
MULTIMEDIA PROC 529-LFBGA
Manufacturer
Freescale Semiconductor
Series
i.MX51r
Datasheets

Specifications of MCIMX512CJM6C

Core Processor
ARM Cortex-A8
Core Size
32-Bit
Speed
600MHz
Connectivity
1-Wire, EBI/EMI, Ethernet, I²C, IrDA, MMC, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
128
Program Memory Type
ROMless
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
0.8 V ~ 1.15 V
Oscillator Type
External
Operating Temperature
-20°C ~ 85°C
Package / Case
529-LFBGA
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Processor Series
i.MX51
Core
ARM Cortex A8
Data Bus Width
32 bit
Program Memory Size
36 KB
Data Ram Size
128 KB
Interface Type
I2C, SPI, SSI, UART, USB
Maximum Clock Frequency
200 MHz
Number Of Timers
5
Operating Supply Voltage
0.8 V to 1.15 V
Maximum Operating Temperature
+ 95 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
MCIMX51EVKJ
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Compliant
4.5.2
Table 30
4.5.3
Freescale Semiconductor
1
1
Output Pad di/dt (Low drive)
Input Transition Times
Output Pad Transition Times (Max
Drive)
Output Pad Transition Times (High
Drive)
Output Pad Transition Times (Medium
Drive)
Output Pad Transition Times (Low Drive)
Output Pad Slew Rate (Max Drive)
Output Pad Slew Rate (High Drive)
Output Pad Slew Rate (Medium Drive)
Output Pad Slew Rate (Low Drive)
Output Pad di/dt (Max Drive)
Output Pad di/dt (High Drive)
Output Pad di/dt (Medium drive)
Output Pad di/dt (Low drive)
Input Transition Times
Hysteresis mode is recommended for inputs with transition times greater than 25 ns.
Hysteresis mode is recommended for inputs with transition time greater than 25 ns.
shows the fast I/O AC parameters.
Fast I/O AC Parameters
I
2
Parameter
C AC Parameters
Parameter
See the errata for HS-I
standard I
i.MX51 Applications Processors for Consumer and Industrial Products, Rev. 4
1
1
2
C modules have no errata
Table 29. Slow I/O AC Parameters (continued)
Table 30. Fast I/O AC Parameters
Symbol
2
C in the i.MX51 Chip Errata document. The two
tr, tf
tr, tf
tr, tf
tr, tf
trm
tps
tps
tps
tps
tdit
tdit
tdit
tdit
Symbol Test Condition Min Rise/Fall
trm
tdit
Condition
NOTE
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
Test
Min Rise/Fall
0.69/0.78
0.36/0.39
0.55/0.62
0.28/0.30
0.39/0.44
0.19/0.20
0.21/0.22
0.09/0.1
Typ
Typ
Max Rise/Fall
1.429/1.275
2.770/2.526
1.793/1.607
2.542/2.257
5.252/4.918
4.641/4.456
10.699/10.0
Electrical Characteristics
Max Rise/Fall
3.565/3.29
70
53
35
18
25
25
7
mA/ns
mA/ns
mA/ns
mA/ns
mA/ns
Unit
V/ns
V/ns
V/ns
V/ns
Unit
ns
ns
ns
ns
ns
ns
35

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