MC9S12C128CPBE Freescale Semiconductor, MC9S12C128CPBE Datasheet - Page 181

IC MCU 128K FLASH 25MHZ 52-LQFP

MC9S12C128CPBE

Manufacturer Part Number
MC9S12C128CPBE
Description
IC MCU 128K FLASH 25MHZ 52-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheets

Specifications of MC9S12C128CPBE

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
35
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
52-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

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Figure 6-9
target, there is up to a one clock-cycle delay from the host-generated falling edge on BKGD to the start of
the bit time as perceived by the target. The host initiates the bit time but the target finishes it. Because the
target wants the host to receive a logic 0, it drives the BKGD pin low for 13 target clock cycles then briefly
drives it high to speed up the rising edge. The host samples the bit level about 10 target clock cycles after
starting the bit time.
Freescale Semiconductor
TARGET SYSTEM
TARGET SYSTEM
SPEEDUP PULSE
TARGET SYS.
START OF BIT TIME
TARGET SYS.
START OF BIT TIME
BKGD PIN
DRIVE AND
BKGD PIN
SPEEDUP
DRIVE TO
BKGD PIN
DRIVE TO
BKGD PIN
CLOCK
CLOCK
PULSE
HOST
PERCEIVED
HOST
shows the host receiving a logic 0 from the target. Because the host is asynchronous to the
PERCEIVED
Figure 6-8. BDM Target-to-Host Serial Bit Timing (Logic 1)
Figure 6-9. BDM Target-to-Host Serial Bit Timing (Logic 0)
HIGH-IMPEDANCE
10 CYCLES
MC9S12C-Family / MC9S12GC-Family
10 CYCLES
R-C RISE
10 CYCLES
10 CYCLES
Rev 01.24
Chapter 6 Background Debug Module (BDMV4) Block Description
HIGH-IMPEDANCE
HOST SAMPLES
HIGH-IMPEDANCE
HOST SAMPLES
BKGD PIN
BKGD PIN
SPEEDUP PULSE
HIGH-IMPEDANCE
EARLIEST
START OF
NEXT BIT
EARLIEST
START OF
NEXT BIT
181

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