EP1S10F780I6N Altera, EP1S10F780I6N Datasheet - Page 367

IC STRATIX FPGA 10K LE 780-FBGA

EP1S10F780I6N

Manufacturer Part Number
EP1S10F780I6N
Description
IC STRATIX FPGA 10K LE 780-FBGA
Manufacturer
Altera
Series
Stratix®r
Datasheet

Specifications of EP1S10F780I6N

Number Of Logic Elements/cells
10570
Number Of Labs/clbs
1057
Total Ram Bits
920448
Number Of I /o
426
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
780-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-

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0
Revision History
Altera Corporation
Chapter
2
April 2004, v3.0
July 2005, v3.3
July 2003, v2.0
January 2005,
Date/Version
September
2004, v3.1
v3.2
This section provides information on the TriMatrix
blocks internal to Stratix
interfaces.
It contains the following chapters:
The QDR SRAM Controller Reference Design for Stratix & Stratix GX Devices
chapter is removed in this version of the Stratix Device Handbook. The
information is available in AN 349: Interfacing QDR SRAM with Stratix and
Stratix GX Devices.
The table below shows the revision history for
Updated
Minor technical content update.
Updated Note 1 in
Updated description about using two different clocks in a
dual-port RAM on
Deleted description of M-RAM block and document
references on
Synchronous occurrences are renamed to pipelined.
Pseudo-synchronous occurrences are renamed flow-
through.
Added AND gate to
Updated performance specification for TriMatrix memory
in Table 2-1.
Added addressing example for a RAM that is using
mixed-width mode, page 2-9.
Added Note 1 to Tables 2-9 and 2-10, Note 3 to Figure 2-
11, and Note 2 to Figures 2-12 and 2-13.
Chapter 2, TriMatrix Embedded Memory Blocks in
Stratix & Stratix GX Devices
Chapter 3, External Memory Interfaces in Stratix & Stratix GX
Devices
“Implementing True Dual-Port Mode”
page
page
Figure 2–12 on page
Changes Made
2–27.
Figure
®
2–27.
devices and the supported external memory
2–12.
Section II. Memory
2–22.
section.
Chapters 2
Embedded Memory
and 3.
Comments
Section II–1

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