FW80960VH100 Intel, FW80960VH100 Datasheet - Page 3

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FW80960VH100

Manufacturer Part Number
FW80960VH100
Description
IC MPU I960VH 3V 100MHZ 324-BGA
Manufacturer
Intel
Datasheet

Specifications of FW80960VH100

Rohs Status
RoHS non-compliant
Processor Type
i960
Features
VH suffix, 32-Bit, 16K Cache
Speed
100MHz
Voltage
3V
Mounting Type
Surface Mount
Package / Case
324-BGA
Other names
820682

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FW80960VH100
Manufacturer:
Intel
Quantity:
10 000
Contents
1.0
2.0
3.0
4.0
Preliminary
Datasheet
About This Document......................................................................................................... 7
1.1
1.2
1.3
Functional Overview........................................................................................................... 8
2.1
2.2
Package Information ........................................................................................................15
3.1
3.2
Electrical Specifications.................................................................................................... 35
4.1
4.2
4.3
4.4
4.5
4.6
4.7
Solutions960
Terminology........................................................................................................... 7
Additional Information Sources ............................................................................. 7
Key Functional Units ............................................................................................. 9
2.1.1
2.1.2
2.1.3
2.1.4
2.1.5
2.1.6
i960
2.2.1
2.2.2
2.2.3
2.2.4
2.2.5
2.2.6
2.2.7
2.2.8
2.2.9
Package Introduction........................................................................................... 15
3.1.1
3.1.2
Package Thermal Specifications .........................................................................33
3.2.1
3.2.2
V
V
DC Specifications ................................................................................................ 37
AC Specifications ................................................................................................ 39
4.4.1
4.4.2
4.4.3
4.4.4
AC Test Conditions ............................................................................................. 44
AC Timing Waveforms ........................................................................................ 45
Memory Controller Output Timing Waveforms ....................................................48
CC5
CCPLL
®
Pin Requirements (V
Core Features (80960JT) .......................................................................... 10
Pin Requirements ................................................................................... 36
DMA Controller......................................................................................... 9
Address Translation Unit .......................................................................... 9
Messaging Unit......................................................................................... 9
Memory Controller.................................................................................... 9
Core and Peripheral Unit.......................................................................... 9
I2C Bus Interface Unit .............................................................................. 9
Burst Bus................................................................................................ 11
Timer Unit ............................................................................................... 11
Priority Interrupt Controller ..................................................................... 11
Faults and Debugging ............................................................................ 11
On-Chip Cache and Data RAM .............................................................. 12
Local Register Cache ............................................................................. 12
Test Features ......................................................................................... 12
Memory-Mapped Control Registers ....................................................... 12
Instructions, Data Types and Memory Addressing Modes .....................13
Functional Signal Definitions ..................................................................15
324-Lead PBGA Package ...................................................................... 25
Thermal Specifications ........................................................................... 33
3.2.1.1 Ambient Temperature................................................................ 33
3.2.1.2 Case Temperature .................................................................... 33
3.2.1.3 Thermal Resistance ..................................................................34
Thermal Analysis .................................................................................... 34
Relative Output Timings .........................................................................41
Memory Controller Relative Output Timings .......................................... 41
Boundary Scan Test Signal Timings ...................................................... 43
I2C Interface Signal Timings ..................................................................44
®
Program......................................................................................... 7
DIFF
) .......................................................................... 35
80960VH
3

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