FW80960VH100 Intel, FW80960VH100 Datasheet - Page 34

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FW80960VH100

Manufacturer Part Number
FW80960VH100
Description
IC MPU I960VH 3V 100MHZ 324-BGA
Manufacturer
Intel
Datasheet

Specifications of FW80960VH100

Rohs Status
RoHS non-compliant
Processor Type
i960
Features
VH suffix, 32-Bit, 16K Cache
Speed
100MHz
Voltage
3V
Mounting Type
Surface Mount
Package / Case
324-BGA
Other names
820682

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
FW80960VH100
Manufacturer:
Intel
Quantity:
10 000
80960VH
3.2
3.2.1
3.2.1.1
3.2.1.2
34
Figure 5. Thermocouple Attachment
Package Thermal Specifications
The device is specified for operation when T
95° C. Case temperature may be measured in any environment to determine whether the processor
is within specified operating range. Measure the case temperature at the center of the top surface,
opposite the ballpad.
Thermal Specifications
This section defines the terms used for thermal analysis.
Ambient Temperature
Ambient temperature, T
system environment, ambient temperature is the temperature of the air upstream from the package.
Case Temperature
To ensure functionality and reliability, the device is specified for proper operation when the case
temperature, T
When measuring case temperature, attention to detail is required to ensure accuracy. If a
thermocouple is used, then calibrate it before taking measurements. Errors may result when the
measured surface temperature is affected by the surrounding ambient air temperature. Such errors
may be due to a poor thermal contact between thermocouple junction and the surface, heat loss by
radiation, or conduction through thermocouple leads.
To minimize measurement errors:
Use a 35 gauge K-type thermocouple or equivalent.
Attach the thermocouple bead or junction to the package top surface at a location
corresponding to the center of the die (). The center of the die gives a more accurate
measurement and less variation as the boundary condition changes.
Attach the thermocouple bead or junction at a 90° angle by an adhesive bond (such as thermal
epoxy or heat-tolerant tape) to the package top surface as shown in .
C
, is within the specified range in
A
, is the temperature of the ambient air surrounding the package. In a
Thermocouple Wire
Epoxy Fillet
C
(case temperature) is within the range of 0° C to
Table 16, Operating Conditions (pg.
Thermocouple Bead
Preliminary Datasheet
36).

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