CS4525-CNZ Cirrus Logic Inc, CS4525-CNZ Datasheet - Page 57

• Manufacturer Part Number: CS4525-CNZ
• Description: IC AMP AUDIO PWR 30W QUAD 48QFN
• Manufacturer: Cirrus Logic Inc
• Series: Popguard®r
• Type: Class Dr

Specifications of CS4525-CNZ

• Output Type: 2-Channel (Stereo) or 4-Channel (Quad)
• Package / Case: 48-QFN
• Max Output Power X Channels @ Load: 30W x 1 @ 4 Ohm; 15W x 2 @ 8 Ohm
• Voltage - Supply: 8 V ~ 18 V
• Features: ADC, Depop, I²C, I²S, Mute, PWM, Short-Circuit and Thermal Protection, Volume Control
• Mounting Type: Surface Mount
• Product: Class-D
• Output Power: 30 W
• Thd Plus Noise: 10 %
• Operating Supply Voltage: 2.5 V to 5 V
• Supply Current: 54 mA
• Maximum Power Dissipation: 180 mW
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• Audio - Load Impedance: 4 Ohms, 6 Ohms, 8 Ohms
• Audio Load Resistance: 8 Ohms, 4 Ohms
• Minimum Operating Temperature: 0 C
• Supply Voltage (max): 5.25 V
• Supply Voltage (min): 2.375 V
• Amplifier Class: D
• No. Of Channels: 4
• Supply Voltage Range: 8V To 18V
• Load Impedance: 4ohm
• Operating Temperature Range: 0°C To +70°C
• Amplifier Case Style: QFN
• No. Of Pins: 48
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 598-1586 - REFERENCE BOARD FOR CS4525 PWM
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 598-1264

DS726PP2
6.2.6
Thermal Foldback
In hardware mode, the CS4525 implements a thermal foldback feature to guard against damaging thermal
overload conditions. The thermal foldback feature begins limiting the volume of the digital audio input to
the amplifier stage as the junction temperatures rise above the maximum safe operating range specified
by the thermal warning trigger point listed in the
This effectively limits the output power capability of the device, thereby allowing the temperature to reduce
to acceptable levels without fully interrupting operation. As the device cools, the applied attenuation is
gradually released until a new thermal equilibrium is reached or all applied attenuation has been released
thereby allowing the device to again achieve its full output power capability.
Attenuation applied due to thermal foldback reduces the audio output level in a linear manner.
below demonstrates the foldback process.
Thermal warning conditions will only affect the foldback algorithm and cause attenuation to be applied if
enabled by the EN_TFB pin as shown in
Thermal Warning
1
2
3
Threshold
When the junction temperature crosses the thermal warning threshold, the foldback attack delay timer is started.
When the foldback attack delay timer reaches t
thermal warning threshold, the output volume level is lowered by 0.5 dB and the foldback attack timer is restarted.
The junction temperature is checked after each foldback attack timer timeout, and if necessary, the output volume
level is lowered accordingly.
If the junction temperature is found to be below the thermal warning threshold, the foldback attack timer is
restarted once again, but the output volume level is not altered. The foldback algorithm then proceeds to step 3.
The junction temperature is checked once again after the next foldback attack timer timeout. If is has remained
below the thermal warning threshold since the last check, the device will begin to release any attenuation applied
as a result of the foldback event.
If the junction temperature crosses the thermal warning threshold again, the foldback algorithm will once again
enter step 1.
EN_TFB
Foldback Attack Delay
Approximately 2 sec.
High
Low
Table 16. Thermal Foldback Enable Selection
1
t
delay
2
Figure 25. Foldback Process
t
delay
Table 16
Selected Thermal Foldback Enable State
2
t
delay
delay
2
seconds, the junction temperature is checked. If it is above the
PWM Power Output Characteristics
below.
Thermal foldback disabled.
Thermal foldback enabled.
t
delay
2
t
delay
3
table on
1
CS4525
Figure 18
page
20.
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