PIC18F25J11-I/ML Microchip Technology, PIC18F25J11-I/ML Datasheet - Page 50
![IC PIC MCU FLASH 32K 2V 28-QFN](/photos/6/81/68120/150-28-qfn_sml.jpg)
PIC18F25J11-I/ML
Manufacturer Part Number
PIC18F25J11-I/ML
Description
IC PIC MCU FLASH 32K 2V 28-QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.MA180023.pdf
(528 pages)
2.PIC18LF24J10-ISS.pdf
(32 pages)
3.PIC18F24J11-ISS.pdf
(14 pages)
Specifications of PIC18F25J11-I/ML
Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Core Processor
PIC
Speed
48MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Program Memory Type
FLASH
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2.15 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Controller Family/series
PIC18
No. Of I/o's
16
Ram Memory Size
3.6875KB
Cpu Speed
48MHz
No. Of Timers
5
Interface
EUSART, I2C, SPI
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3776 B
Interface Type
EUSART, I2C, SPI
Maximum Clock Frequency
48 MHz
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM183022, DM183032, DV164136, MA180023
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F25J11-I/ML
Manufacturer:
MICROCHIP
Quantity:
4 000
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Deep Sleep wake-up events are only monitored while
PIC18F46J11 FAMILY
3.6.3
While in Deep Sleep mode, the device can be awakened
by a MCLR, POR, RTCC, INT0 I/O pin interrupt,
DSWDT or ULPWU event. After waking, the device per-
forms a POR. When the device is released from Reset,
code execution will begin at the device’s Reset vector.
The software can determine if the wake-up was caused
from an exit from Deep Sleep mode by reading the DS
bit (WDTCON<3>). If this bit is set, the POR was
caused by a Deep Sleep exit. The DS bit must be
manually cleared by the software.
The software can determine the wake event source by
reading the DSWAKEH and DSWAKEL registers.
When the application firmware is done using the
DSWAKEH and DSWAKEL status registers, individual
bits do not need to be manually cleared before entering
Deep Sleep again. When entering Deep Sleep mode,
these registers are automatically cleared.
3.6.3.1
the processor is fully in Deep Sleep mode. If a wake-up
event occurs before Deep Sleep mode is entered, the
event status will not be reflected in the DSWAKE regis-
ters. If the wake-up source asserts prior to entering
Deep Sleep, the CPU may go to the interrupt vector (if
the wake source has an interrupt bit and the interrupt is
fully enabled), and may abort the Deep Sleep entry
sequence by executing past the SLEEP instruction. In
this case, a wake-up event handler should be placed
after the SLEEP instruction to process the event and
re-attempt entry into Deep Sleep if desired.
When the device is in Deep Sleep with more than one
wake-up source simultaneously enabled, only the first
wake-up source to assert will be detected and logged
in the DSWAKEH/DSWAKEL status registers.
DS39932C-page 50
DEEP SLEEP WAKE-UP SOURCES
Wake-up Event Considerations
DSWDTOSC bit (CONFIG3L<0>).
optionally enabled through the DSBOREN Configuration
3.6.4
Deep Sleep has its own dedicated WDT (DSWDT) with
a postscaler for time-outs of 2.1 ms to 25.7 days,
configurable
(CONFIG3L<7:4>).
The DSWDT can be clocked from either the INTRC or
the T1OSC/T1CKI input. If the T1OSC/T1CKI source will
be used with a crystal, the T1OSCEN bit in the T1CON
register needs to be set prior to entering Deep Sleep.
The reference clock source is configured through the
DSWDT is enabled through the DSWDTEN bit
(CONFIG3L<3>). Entering Deep Sleep mode automati-
cally clears the DSWDT. See Section 25.0 “Special
Features of the CPU” for more information.
3.6.5
The Deep Sleep module contains a dedicated Deep
Sleep BOR (DSBOR) circuit. This circuit may be
bit (CONFIG3L<2>).
The DSBOR circuit monitors the V
voltage. The behavior of the DSBOR circuit is
described in Section 4.4 “Brown-out Reset (BOR)”.
3.6.6
The RTCC can operate uninterrupted during Deep
Sleep mode. It can wake the device from Deep Sleep by
configuring an alarm.
The RTCC clock source is configured with the RTCOSC
bit (CONFIG3L<1>). The available reference clock
sources are the INTRC and T1OSC/T1CKI. If the INTRC
is used, the RTCC accuracy will directly depend on the
INTRC tolerance. For more information on configuring
the RTCC peripheral, see Section 16.0 “Real-Time
Clock and Calendar (RTCC)”.
DEEP SLEEP WATCHDOG TIMER
(DSWDT)
DEEP SLEEP BROWN OUT RESET
(DSBOR)
RTCC PERIPHERAL AND DEEP
SLEEP
through
© 2009 Microchip Technology Inc.
the
bits,
DSWDTPS<3:0>
DD
supply rail
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