DSPIC30F2012-30I/SP Microchip Technology, DSPIC30F2012-30I/SP Datasheet - Page 148

• Manufacturer Part Number: DSPIC30F2012-30I/SP
• Description: IC DSPIC MCU/DSP 12K 28DIP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2012-30I/SP

• Program Memory Type: FLASH
• Program Memory Size: 12KB (4K x 24)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 20
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 12
• Data Ram Size: 1 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300027, DM330011, DM300018, DM183021
• Minimum Operating Temperature: - 40 C
• Core Frequency: 30MHz
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 20
• Flash Memory Size: 12KB
• Supply Voltage Range: 2.5V To 5.5V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F201230ISP

dsPIC30F2011/2012/3012/3013
TABLE 20-2:
TABLE 20-3:
TABLE 20-4:
DS70139E-page 146
dsPIC30F201x-30I
dsPIC30F301x-30I
dsPIC30F201x-20E
dsPIC30F301x-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 18-pin PDIP (P)
Package Thermal Resistance, 18-pin SOIC (SO)
Package Thermal Resistance, 28-pin SPDIP (SP)
Package Thermal Resistance, 28-pin (SOIC)
Package Thermal Resistance, 44-pin QFN
Note 1:
DC CHARACTERISTICS
Operating Voltage
DC10
DC11
DC12
DC16
DC17
Note 1:
Param
No.
2:
3:
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
P
V
V
V
V
S
I
Symbol
INT
/
Junction to ambient thermal resistance, Theta-ja (
“Typ” column data is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
This is the limit to which V
DD
DD
DR
POR
VDD
O
=
=
∑
V
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
THERMAL OPERATING CONDITIONS
D D
(2)
V
Supply Voltage
Supply Voltage
RAM Data Retention Voltage
V
internal Power-on Reset signal)
V
internal Power-on Reset signal)
D D
DD
DD
I
–
D D
Start Voltage (to ensure
Rise Rate (to ensure
V
Characteristic
–
O H
∑
Rating
Characteristic
I
O H
I
OH
DD
+
∑
can be lowered without losing RAM data.
V
O L
I
O L
(3)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
0.05
Min
2.5
3.0
—
—
JA
) numbers are achieved by package simulations.
Typ
V
1.5
—
—
SS
Symbol
Symbol
P
(1)
DMAX
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
Max
5.5
5.5
—
—
Min
Typ
-40
-40
-40
-40
44
57
42
49
28
-40°C T
-40°C
Units
V/ms 0-5V in 0.1 sec
V
V
V
V
(T
© 2006 Microchip Technology Inc.
P
J
INT
Industrial temperature
Extended temperature
0-3V in 60 ms
- T
T
Max
Typ
A
A
—
—
—
—
—
+ P
A
) /
+85°C for Industrial
+125°C for Extended
I
/
O
Conditions
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+150
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1