DSPIC30F2012-30I/SP Microchip Technology, DSPIC30F2012-30I/SP Datasheet - Page 188

• Manufacturer Part Number: DSPIC30F2012-30I/SP
• Description: IC DSPIC MCU/DSP 12K 28DIP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2012-30I/SP

• Program Memory Type: FLASH
• Program Memory Size: 12KB (4K x 24)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 20
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 12
• Data Ram Size: 1 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300027, DM330011, DM300018, DM183021
• Minimum Operating Temperature: - 40 C
• Core Frequency: 30MHz
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 20
• Flash Memory Size: 12KB
• Supply Voltage Range: 2.5V To 5.5V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F201230ISP

dsPIC30F2011/2012/3012/3013
18-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
DS70139E-page 186
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-051
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
Dimension Limits
§
E1
E
h
Units
A2
A1
E1
E
D
B
n
p
A
h
L
c
2
1
MIN
L
.093
.088
.004
.394
.446
.010
.016
.009
.014
D
.291
0
0
0
INCHES*
NOM
18
.050
.099
.008
.407
.295
.454
.020
.033
.017
.091
.011
A
12
12
A1
4
MAX
.104
.094
.012
.420
.299
.462
.029
.050
.012
.020
15
15
8
MIN
11.33
10.01
2.36
2.24
0.10
7.39
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
© 2006 Microchip Technology Inc.
NOM
18
10.34
11.53
1.27
2.50
0.20
7.49
0.50
0.84
0.27
0.42
2.31
12
12
4
MAX
10.67
11.73
A2
2.64
2.39
0.30
7.59
0.74
1.27
0.30
0.51
15
15
8