ATMEGA32-16PU Atmel, ATMEGA32-16PU Datasheet - Page 220

IC AVR MCU 32K 16MHZ 5V 40DIP

ATMEGA32-16PU

Manufacturer Part Number
ATMEGA32-16PU
Description
IC AVR MCU 32K 16MHZ 5V 40DIP
Manufacturer
Atmel
Series
AVR® ATmegar
Datasheets

Specifications of ATMEGA32-16PU

Core Processor
AVR
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
32
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Processor Series
ATMEGA32x
Core
AVR8
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
2-Wire/SPI/USART
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
32
Number Of Timers
3
Operating Supply Voltage
4.5 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
A/d Inputs
8-Channel, 10-Bit
Cpu Speed
16 MIPS
Eeprom Memory
1K Bytes
Input Output
32
Interface
2-Wire/SPI/USART
Memory Type
Flash
Number Of Bits
8
Package Type
40-pin PDIP
Programmable Memory
32K Bytes
Timers
2-8-bit, 1-16-bit
Voltage, Range
4.5-5.5 V
Data Rom Size
1024 B
Height
4.83 mm
Length
52.58 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Width
13.97 mm
Controller Family/series
AVR MEGA
No. Of I/o's
32
Eeprom Memory Size
1024Byte
Ram Memory Size
2KB
Rohs Compliant
Yes
For Use With
ATSTK524 - KIT STARTER ATMEGA32M1/MEGA32C1ATSTK600-TQFP32 - STK600 SOCKET/ADAPTER 32-TQFPATSTK600-TQFP44 - STK600 SOCKET/ADAPTER 44-TQFPATSTK600-DIP40 - STK600 SOCKET/ADAPTER 40-PDIP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRDRAGON - KIT DRAGON 32KB FLASH MEM AVRATAVRISP2 - PROGRAMMER AVR IN SYSTEMATJTAGICE2 - AVR ON-CHIP D-BUG SYSTEMATSTK500 - PROGRAMMER AVR STARTER KIT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATMEGA32-16PU
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
Using the Boundary-
scan Chain
Using the On-chip Debug
System
220
ATmega32(L)
As shown in the state diagram, the Run-Test/Idle state need not be entered between
selecting JTAG instruction and using Data Registers, and some JTAG instructions may
select certain functions to be performed in the Run-Test/Idle, making it unsuitable as an
Idle state.
Note:
For detailed information on the JTAG specification, refer to the literature listed in “Bibli-
ography” on page 222.
A complete description of the Boundary-scan capabilities are given in the section “IEEE
1149.1 (JTAG) Boundary-scan” on page 223.
As shown in Figure 112, the hardware support for On-chip Debugging consists mainly
of:
All read or modify/write operations needed for implementing the Debugger are done by
applying AVR instructions via the internal AVR CPU Scan Chain. The CPU sends the
result to an I/O memory mapped location which is part of the communication interface
between the CPU and the JTAG system.
The Break Point Unit implements Break on Change of Program Flow, Single Step
Break, 2 Program Memory Break Points, and 2 combined Break Points. Together, the 4
Break Points can be configured as either:
this state is left by setting TMS high. While the instruction is shifted in from the TDI
pin, the captured IR-state 0x01 is shifted out on the TDO pin. The JTAG Instruction
selects a particular Data Register as path between TDI and TDO and controls the
circuitry surrounding the selected Data Register.
Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. The instruction
is latched onto the parallel output from the Shift Register path in the Update-IR
state. The Exit-IR, Pause-IR, and Exit2-IR states are only used for navigating the
state machine.
At the TMS input, apply the sequence 1, 0, 0 at the rising edges of TCK to enter the
Shift Data Register – Shift-DR state. While in this state, upload the selected Data
Register (selected by the present JTAG instruction in the JTAG Instruction Register)
from the TDI input at the rising edge of TCK. In order to remain in the Shift-DR state,
the TMS input must be held low during input of all bits except the MSB. The MSB of
the data is shifted in when this state is left by setting TMS high. While the Data
Register is shifted in from the TDI pin, the parallel inputs to the Data Register
captured in the Capture-DR state is shifted out on the TDO pin.
Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. If the selected
Data Register has a latched parallel-output, the latching takes place in the Update-
DR state. The Exit-DR, Pause-DR, and Exit2-DR states are only used for navigating
the state machine.
A scan chain on the interface between the internal AVR CPU and the internal
peripheral units
Break Point unit
Communication interface between the CPU and JTAG system
4 single Program Memory Break Points
3 Single Program Memory Break Point + 1 single Data Memory Break Point
2 single Program Memory Break Points + 2 single Data Memory Break Points
Independent of the initial state of the TAP Controller, the Test-Logic-Reset state can
always be entered by holding TMS high for five TCK clock periods.
2503G–AVR–11/04

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