P89V52X2FA,512 NXP Semiconductors, P89V52X2FA,512 Datasheet - Page 11
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P89V52X2FA,512
Manufacturer Part Number
P89V52X2FA,512
Description
IC 80C51 MCU FLASH 8K 44-PLCC
Manufacturer
NXP Semiconductors
Series
89Vr
Datasheet
1.P89V52X2FA512.pdf
(57 pages)
Specifications of P89V52X2FA,512
Program Memory Type
FLASH
Program Memory Size
8KB (8K x 8)
Package / Case
44-PLCC
Core Processor
8051
Core Size
8-Bit
Speed
40MHz
Connectivity
UART/USART
Peripherals
POR
Number Of I /o
32
Eeprom Size
192 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
P89V5x
Core
80C51
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
32
Number Of Timers
3
Operating Supply Voltage
2.7 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
OM11011 - BOARD FOR P89V52X2 44-TQFP622-1017 - BOARD 44-ZIF PLCC SOCKET622-1012 - BOARD FOR P89V52X2 44-TQFP622-1008 - BOARD FOR LPC9103 10-HVSON622-1002 - USB IN-CIRCUIT PROG LPC9XX
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4249-5
935282528512
P89V52X2FA
935282528512
P89V52X2FA
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
P89V52X2FA,512
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
P89V52X2_3
Product data sheet
6.3.1 Clock input options and recommended capacitor values for the oscillator
6.2 Memory organization
6.3 System clock and clock options
The various P89V52X2 memory spaces are as follows:
Shown in
(XTAL1, XTAL2), which can be configured for use as an on-chip oscillator.
When driving the device from an external clock source, XTAL2 should be left disconnected
and XTAL1 should be driven. Power consumption can be further reduced by programming
the EXTCLK bit (UCFG.0).
At start-up, the external oscillator may encounter a higher capacitive load at XTAL1 due to
interaction between the amplifier and its feedback capacitance. However, the capacitance
will not exceed 15 pF once the external signal meets the V
Resonator manufacturer, supply voltage, and other factors may cause circuit performance
to differ from one application to another. C
each design.
frequencies.
Table 4.
Resonator
Quartz
Ceramic
•
•
•
•
DATA
128 B of internal data memory space (00H:7FH) accessed via direct or indirect
addressing, using instructions other than MOVX and MOVC. All or part of the Stack
may be in this area.
IDATA
Indirect Data. 256 B of internal data memory space (00H:FFH) accessed via indirect
addressing using instructions other than MOVX and MOVC. All or part of the Stack
may be in this area. This area includes the DATA area and the 128 B immediately
above it.
SFR
Special Function Registers. Selected CPU registers and peripheral control and status
registers, accessible only via direct addressing.
CODE
64 kB of Code memory space, accessed as part of program execution and via the
MOVC instruction. The P89V52X2 has 8 kB of on-chip Code memory.
Figure 5
Recommended values for C
Table 4
and
shows the typical values for C
Figure 6
Rev. 03 — 4 May 2009
are the input and output of an internal inverting amplifier
1
and C
1
80C51 with 256 B RAM, 192 B data EEPROM
and C
2
C
20 pF to 30 pF
40 pF to 50 pF
by crystal type
1
= C
2
1
should be adjusted appropriately for
2
and C
IL
2
vs. resonator type for various
and V
IH
P89V52X2
specifications.
© NXP B.V. 2009. All rights reserved.
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