P89V52X2FA,512 NXP Semiconductors, P89V52X2FA,512 Datasheet - Page 7
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P89V52X2FA,512
Manufacturer Part Number
P89V52X2FA,512
Description
IC 80C51 MCU FLASH 8K 44-PLCC
Manufacturer
NXP Semiconductors
Series
89Vr
Datasheet
1.P89V52X2FA512.pdf
(57 pages)
Specifications of P89V52X2FA,512
Program Memory Type
FLASH
Program Memory Size
8KB (8K x 8)
Package / Case
44-PLCC
Core Processor
8051
Core Size
8-Bit
Speed
40MHz
Connectivity
UART/USART
Peripherals
POR
Number Of I /o
32
Eeprom Size
192 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
P89V5x
Core
80C51
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
32
Number Of Timers
3
Operating Supply Voltage
2.7 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
OM11011 - BOARD FOR P89V52X2 44-TQFP622-1017 - BOARD 44-ZIF PLCC SOCKET622-1012 - BOARD FOR P89V52X2 44-TQFP622-1008 - BOARD FOR LPC9103 10-HVSON622-1002 - USB IN-CIRCUIT PROG LPC9XX
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4249-5
935282528512
P89V52X2FA
935282528512
P89V52X2FA
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
P89V52X2FA,512
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
Table 2.
[1]
[2]
P89V52X2_3
Product data sheet
Symbol
P3[5]/T1
P3[6]/WR
P3[7]/RD
PSEN
RST
EA
ALE
XTAL1
XTAL2
V
V
DD
SS
ALE loading issue: When ALE pin experiences higher loading (> 30 pF) during the reset, the microcontroller may accidentally enter into
modes other than normal working mode. The solution is to add a pull-up resistor of 3 k to 50 k to V
For 6-clock mode, ALE is emitted at
Pin description
Pin
DIP40
15
16
17
29
9
31
30
19
18
40
20
…continued
LQFP44
11
12
13
26
4
29
27
15
14
38
16
1
3
of crystal frequency.
PLCC44
17
18
19
32
10
35
33
21
20
44
22
Rev. 03 — 4 May 2009
Type
I/O
I
O
O
O
O
I/O
I
I
I/O
I
O
I
I
Description
P3[5] — Port 3 bit 5.
T1 — External count input to Timer/Counter 1
P3[6] — Port 3 bit 6.
WR — External data memory write strobe
P3[7] — Port 3 bit 7.
RD — External data memory read strobe.
Program Store Enable: PSEN is the read strobe for
external program memory. When the device is executing
from internal program memory, PSEN is inactive (HIGH).
When the device is executing code from external program
memory, PSEN is activated twice each machine cycle,
except that two PSEN activations are skipped during each
access to external data memory.
Reset: While the oscillator is running, a HIGH logic state
on this pin for two machine cycles will reset the device.
External Access Enable: EA must be connected to V
order to enable the device to fetch code from the external
program memory. EA must be strapped to V
program execution.
Address Latch Enable: ALE is the output signal for
latching the low byte of the address during an access to
external memory. Normally the ALE
constant rate of
used for external timing and clocking. One ALE pulse is
skipped during each access to external data memory.
However, if AO is set to ‘1’, ALE is disabled.
Crystal 1: Input to the inverting oscillator amplifier and
input to the internal clock generator circuits.
Crystal 2: Output from the inverting oscillator amplifier.
Power supply
Ground
80C51 with 256 B RAM, 192 B data EEPROM
1
6
the crystal frequency
DD
, e.g., for ALE pin.
P89V52X2
[1]
is emitted at a
© NXP B.V. 2009. All rights reserved.
[2]
and can be
DD
for internal
7 of 57
SS
in