LPC2470FET208,551 NXP Semiconductors, LPC2470FET208,551 Datasheet - Page 51

• Manufacturer Part Number: LPC2470FET208,551
• Description: IC ARM7 MCU LCD 208-TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2470FET208,551

• Package / Case: 208-TFBGA
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Program Memory Type: ROMless
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2470U
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 208TFBGA
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Operating Supply Voltage: 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4362; 935284071551; LPC2470FET208-S

NXP Semiconductors
10. Static characteristics
Table 8.
T
LPC2470
Product data sheet
Symbol
V
V
V
V
V
I
I
I
I
I
Standard port pins, RESET, RTCK
I
I
I
I
V
V
V
DD(DCDC)act(3V3)
DD(DCDC)pd(3V3)
DD(DCDC)dpd(3V3)
BATact
BAT
IL
IH
OZ
latch
amb
DD(3V3)
DD(DCDC)(3V3)
DDA
i(VBAT)
i(VREF)
I
O
IH
= −40 °C to +85 °C for commercial applications, unless otherwise specified.
Static characteristics
Parameter
supply voltage (3.3 V)
DC-to-DC converter
supply voltage (3.3 V)
analog 3.3 V pad
supply voltage
input voltage on pin
VBAT
input voltage on pin
VREF
active mode DC-to-DC
converter supply
current (3.3 V)
Power-down mode
DC-to-DC converter
supply current (3.3 V)
Deep power-down
mode DC-to-DC
converter supply
current (3.3 V)
active mode battery
supply current
battery supply current
LOW-level input
current
HIGH-level input
current
OFF-state output
current
I/O latch-up current
input voltage
output voltage
HIGH-level input
voltage
All information provided in this document is subject to legal disclaimers.
Conditions
core and external rail
V
T
while(1){}
executed from the on-chip
SRAM; no peripherals
enabled; PCLK = CCLK / 8
V
T
Deep power-down mode
V
V
V
no pull-up/down
−(0.5V
(1.5V
T
pin configured to provide a
digital function
output active
amb
amb
j
DD(DCDC)(3V3)
DD(DCDC)(3V3)
I
I
O
CCLK = 12 MHz
CCLK = 72 MHz
< 125 °C
= 0 V; no pull-up
= V
= 0 V; V
= 25 °C; code
= 25 °C
DD(3V3)
DD(3V3)
DD(3V3)
Rev. 3 — 14 February 2011
O
);
; no pull-down
) < V
= V
= 3.3 V;
= 3.3 V;
DD(3V3)
I
<
;
[5][6][7]
[2]
[3]
[3]
[4]
[3]
[8]
Min
3.0
3.0
3.0
2.0
2.5
-
-
-
-
-
-
-
-
-
-
0
0
2.0
Flashless 16-bit/32-bit microcontroller
Typ
3.3
3.3
3.3
3.3
3.3
17.4
66.1
113
20
20
20
-
-
-
-
-
-
-
[1]
LPC2470
© NXP B.V. 2011. All rights reserved.
Max
3.6
3.6
3.6
3.6
V
-
-
-
-
-
-
3
3
3
100
5.5
V
-
DDA
DD(3V3)
51 of 89
Unit
V
V
V
V
V
mA
mA
μA
μA
μA
μA
μA
μA
μA
mA
V
V
V