LPC2470FET208,551 NXP Semiconductors, LPC2470FET208,551 Datasheet - Page 89

• Manufacturer Part Number: LPC2470FET208,551
• Description: IC ARM7 MCU LCD 208-TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2470FET208,551

• Package / Case: 208-TFBGA
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Program Memory Type: ROMless
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2470U
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 208TFBGA
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Operating Supply Voltage: 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4362; 935284071551; LPC2470FET208-S

NXP Semiconductors
11.4
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14.3
14.4
14.5
14.6
14.7
14.8
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18.1
18.2
18.3
18.4
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ADC electrical characteristics . . . . . . . . . . . . 65
DAC electrical characteristics . . . . . . . . . . . . 68
Application information. . . . . . . . . . . . . . . . . . 68
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 82
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 85
Legal information. . . . . . . . . . . . . . . . . . . . . . . 86
Contact information. . . . . . . . . . . . . . . . . . . . . 87
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Static external memory interface . . . . . . . . . . 60
Dynamic external memory interface . . . . . . . . 62
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
layout guidelines . . . . . . . . . . . . . . . . . . . . . . . 80
LCD panel signal usage . . . . . . . . . . . . . . . . . 68
Suggested boot memory interface solutions. . 71
Suggested USB interface solutions . . . . . . . . 72
Crystal oscillator XTAL input and component
RTC 32 kHz oscillator component selection . . 79
XTAL and RTCX Printed Circuit Board (PCB)
Standard I/O pin configuration . . . . . . . . . . . . 80
Reset pin configuration . . . . . . . . . . . . . . . . . . 81
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 86
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Flashless 16-bit/32-bit microcontroller
Date of release: 14 February 2011
Document identifier: LPC2470
LPC2470
All rights reserved.