LPC2470FET208,551 NXP Semiconductors, LPC2470FET208,551 Datasheet - Page 58

• Manufacturer Part Number: LPC2470FET208,551
• Description: IC ARM7 MCU LCD 208-TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2470FET208,551

• Package / Case: 208-TFBGA
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Program Memory Type: ROMless
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2470U
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 208TFBGA
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Operating Supply Voltage: 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4362; 935284071551; LPC2470FET208-S

NXP Semiconductors
11. Dynamic characteristics
Table 9.
T
[1]
[2]
[3]
LPC2470
Product data sheet
Symbol
External clock
f
T
t
t
t
t
I
t
SSP interface
t
osc
CHCX
CLCX
CLCH
CHCL
2
f(o)
su(SPI_MISO)
amb
Fig 13. External clock timing (with an amplitude of at least V
cy(clk)
C-bus pins (P0[27] and P0[28])
Parameters are valid over operating temperature range unless otherwise specified.
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
Bus capacitance C
= −40 °C to +85 °C for commercial applications; V
Dynamic characteristics
Parameter
oscillator frequency
clock cycle time
clock HIGH time
clock LOW time
clock rise time
clock fall time
output fall time
SPI_MISO set-up time
b
in pF, from 10 pF to 400 pF.
All information provided in this document is subject to legal disclaimers.
t
CHCL
Rev. 3 — 14 February 2011
DD(3V3)
Conditions
V
T
measured in
SPI Master
mode; see
Figure 17
amb
IH
to V
t
CLCX
= 25 °C;
over specified ranges.
IL
i(RMS)
T
cy(clk)
= 200 mV)
t
CLCH
t
CHCX
Min
1
42
T
T
-
-
20 + 0.1 × C
-
cy(clk)
cy(clk)
Flashless 16-bit/32-bit microcontroller
× 0.4
× 0.4
[1]
b
[3]
002aaa907
Typ
-
-
-
-
-
-
-
11
[2]
LPC2470
© NXP B.V. 2011. All rights reserved.
Max
25
1000
-
-
5
5
-
-
58 of 89
Unit
MHz
ns
ns
ns
ns
ns
ns
ns