LPC2470FET208,551 NXP Semiconductors, LPC2470FET208,551 Datasheet - Page 52

• Manufacturer Part Number: LPC2470FET208,551
• Description: IC ARM7 MCU LCD 208-TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2470FET208,551

• Package / Case: 208-TFBGA
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Program Memory Type: ROMless
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2470U
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 208TFBGA
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Operating Supply Voltage: 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4362; 935284071551; LPC2470FET208-S

NXP Semiconductors
Table 8.
T
LPC2470
Product data sheet
Symbol
V
V
V
V
I
I
I
I
I
I
I
V
V
V
V
I
OH
OL
OHS
OLS
pd
pu
2
LI
amb
IL
hys
OH
OL
C-bus pins (P0[27] and P0[28])
IH
IL
hys
OL
= −40 °C to +85 °C for commercial applications, unless otherwise specified.
Static characteristics
Parameter
LOW-level input
voltage
hysteresis voltage
HIGH-level output
voltage
LOW-level output
voltage
HIGH-level output
current
LOW-level output
current
HIGH-level
short-circuit output
current
LOW-level short-circuit
output current
pull-down current
pull-up current
HIGH-level input
voltage
LOW-level input
voltage
hysteresis voltage
LOW-level output
voltage
input leakage current
…continued
All information provided in this document is subject to legal disclaimers.
Conditions
I
I
V
V
V
V
V
V
V
I
V
V
OH
OL
OLS
OH
OL
OH
OL
I
I
DD(3V3)
I
I
= 5 V
= 0 V
= V
= 5 V
= −4 mA
= −4 mA
= 0.4 V
= V
= V
= 0 V
= 3 mA
DD(3V3)
Rev. 3 — 14 February 2011
DDA
DD(3V3)
< V
I
< 5 V
− 0.4 V
[10]
[10]
[12]
[11]
[11]
[9]
[9]
[9]
[9]
[9]
Min
-
0.4
V
0.4
-
−4
4
-
-
10
−15
0
0.7V
-
-
-
-
-
Flashless 16-bit/32-bit microcontroller
DD(3V3)
DD(3V3)
−
Typ
-
-
-
-
-
-
-
-
50
−50
0
-
-
0.05V
-
2
10
[1]
DD(3V3)
LPC2470
© NXP B.V. 2011. All rights reserved.
Max
0.8
-
-
0.4
-
-
−45
50
150
−85
0
-
0.3V
-
0.4
4
22
DD(3V3)
52 of 89
Unit
V
V
V
V
mA
mA
mA
mA
μA
μA
μA
V
V
V
V
μA
μA