LPC2470FET208,551 NXP Semiconductors, LPC2470FET208,551 Datasheet - Page 62

• Manufacturer Part Number: LPC2470FET208,551
• Description: IC ARM7 MCU LCD 208-TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2470FET208,551

• Package / Case: 208-TFBGA
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Program Memory Type: ROMless
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2470U
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 208TFBGA
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Operating Supply Voltage: 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4362; 935284071551; LPC2470FET208-S

NXP Semiconductors
Table 14.
C
Config Register = 0x0 (RD = 00)
[1]
LPC2470
Product data sheet
Symbol
Common
t
t
t
t
t
t
t
t
t
t
t
t
Read cycle parameters
t
t
Write cycle parameters
t
t
d(SV)
h(S)
d(RASV)
h(RAS)
d(CASV)
h(CAS)
d(WV)
h(W)
d(GV)
h(G)
d(AV)
h(A)
su(D)
h(D)
d(QV)
h(Q)
L
= 30 pF, T
See
Figure
Dynamic characteristics: Dynamic external memory interface
amb
Parameter
chip select valid delay time
chip select hold time
row address strobe valid delay time
row address strobe hold time
column address strobe valid delay time
column address strobe hold time
write valid delay time
write hold time
output enable valid delay time
output enable hold time
address valid delay time
address hold time
data input set-up time
data input hold time
data output valid delay time
data output hold time
18.
11.5 Dynamic external memory interface
= −40 °C to 85 °C, V
DD(DCDC)(3V3)
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 February 2011
= V
DD(3V3)
= 3.0 V to 3.6 V, AHB clock = 1 MHz, EMC Dynamic Read
Conditions
Flashless 16-bit/32-bit microcontroller
[1]
[1]
[1]
[1]
[1]
[1]
[1]
[1]
[1]
[1]
[1]
[1]
[1]
[1]
[1]
[1]
Min
-
0.1
-
0.5
-
0.1
-
0.1
-
0.1
-
0.1
0.51
0.57
-
0.49
Typ
1.05
1.02
1.51
1.51
0.98
0.97
0.84
0.84
0.95
1
0.87
0.81
2.24
2.41
2.65
2.61
LPC2470
© NXP B.V. 2011. All rights reserved.
Max
1.76
-
1.95
-
1.27
-
1.95
-
1.86
-
1.95
-
-
-
4.36
-
62 of 89
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns