C8051T606-ZM Silicon Laboratories Inc, C8051T606-ZM Datasheet - Page 29
![IC 8051 MCU 1.5K-EEPROM 10-QFN](/photos/12/15/121567/10-qfn_pkg_sml.jpg)
C8051T606-ZM
Manufacturer Part Number
C8051T606-ZM
Description
IC 8051 MCU 1.5K-EEPROM 10-QFN
Manufacturer
Silicon Laboratories Inc
Series
C8051T60xr
Specifications of C8051T606-ZM
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
6
Program Memory Size
1.5KB (1.5K x 8)
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
10-QFN
Processor Series
C8051T6x
Core
8051
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C, UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
6
Number Of Timers
3
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051T606DK
Minimum Operating Temperature
- 40 C
Eeprom Size
-
Data Converters
-
For Use With
336-1668 - CARD DAUGHTER QFN10 SOCKET336-1667 - CARD DAUGHTER MSOP SOCKET336-1666 - KIT DEVELOPMENT FOR C8051T606336-1404 - KIT DEV FOR C8051T60X MCU'S
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Details
Other names
336-1663-2
C8051T606-ZMR
C8051T606-ZMR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051T606-ZMR
Manufacturer:
STM
Quantity:
4 037
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for
(LMC) is calculated based on a Fabrication Allowance of 0.05mm.
mask and the metal pad is to be 60 m minimum, all the way around the pad.
to assure good solder paste release.
Small Body Components.
C1
C2
e
Table 7.2. QFN-10 PCB Land Pattern Dimensions
Figure 7.2. QFN-10 PCB Land Pattern
1.70
1.70
Min
0.50 BSC.
Max
1.80
1.80
Rev. 1.2
Dimension
C8051T600/1/2/3/4/5/6
X1
Y1
0.20
0.85
Min
Max
0.30
0.95
29