MC56F8346MFVE Freescale Semiconductor, MC56F8346MFVE Datasheet - Page 26

IC DSP 16BIT 60MHZ 144-LQFP

MC56F8346MFVE

Manufacturer Part Number
MC56F8346MFVE
Description
IC DSP 16BIT 60MHZ 144-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr
Datasheet

Specifications of MC56F8346MFVE

Core Processor
56800
Core Size
16-Bit
Speed
60MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
62
Program Memory Size
136KB (68K x 16)
Program Memory Type
FLASH
Ram Size
6K x 16
Voltage - Supply (vcc/vdd)
2.25 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
144-LQFP
Data Bus Width
16 bit
Processor Series
MC56F83xx
Core
56800E
Numeric And Arithmetic Format
Fixed-Point
Device Million Instructions Per Second
60 MIPs
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
62
Data Ram Size
4 KB
Operating Supply Voltage
3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Interface Type
SCI, SPI, CAN
Minimum Operating Temperature
- 40 C
For Use With
MC56F8367EVME - EVAL BOARD FOR MC56F83X
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC56F8346MFVE
Manufacturer:
Freescale
Quantity:
42
Part Number:
MC56F8346MFVE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC56F8346MFVE
Manufacturer:
FREESCALE
Quantity:
20 000
26
Signal Name
(GPIOD8)
(CS0)
WR
RD
PS
Table 2-2 Signal and Package Information for the 144 Pin LQFP
Pin No.
45
44
46
Output
Output
Output
Output
Input/
Type
disabled,
pull-up is
disabled,
pull-up is
disabled,
pull-up is
output is
output is
output is
In reset,
enabled
In reset,
enabled
In reset,
enabled
During
56F8346 Technical Data, Rev. 15
Reset
State
Read Enable — RD is asserted during external memory read
cycles. When RD is asserted low, pins D0 - D15 become inputs
and an external device is enabled onto the data bus. When RD is
deasserted high, the external data is latched inside the device.
When RD is asserted, it qualifies the A0 - A16, PS, DS, and CSn
pins. RD can be connected directly to the OE pin of a static RAM or
ROM.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), RD is tri-stated when the external bus is inactive.
Most designs will want to change the DRV state to DRV = 1 instead of
using the default setting.
To deactivate the internal pull-up resistor, set the CTRL bit in the
SIM_PUDR register.
Write Enable — WR is asserted during external memory write
cycles. When WR is asserted low, pins D0 - D15 become outputs
and the device puts data on the bus. When WR is deasserted high,
the external data is latched inside the external device. When WR is
asserted, it qualifies the A0 - A16, PS, DS, and CSn pins. WR can
be connected directly to the WE pin of a static RAM.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), WR is tri-stated when the external bus is inactive.
Most designs will want to change the DRV state to DRV = 1 instead of
using the default setting.
To deactivate the internal pull-up resistor, set the CTRL bit in the
SIM_PUDR register.
Program Memory Select — This signal is actually CS0 in the EMI,
which is programmed at reset for compatibility with the 56F80x PS
signal. PS is asserted low for external program memory access.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), PS is tri-stated when the external bus is inactive.
CS0 resets to provide the PS function as defined on the 56F80x
devices.
Port D GPIO — This GPIO pin can be individually programmed as
an input or output pin.
To deactivate the internal pull-up resistor, clear bit 8 in the
GPIOD_PUR register.
Signal Description
Freescale Semiconductor
Preliminary

Related parts for MC56F8346MFVE