MC9S08GT16ACFBE Freescale Semiconductor, MC9S08GT16ACFBE Datasheet - Page 144

• Manufacturer Part Number: MC9S08GT16ACFBE
• Description: IC MCU 16K FLASH 2K RAM 44-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08GT16ACFBE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 2KB
• # I/os (max): 36
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: PQFP
• Processor Series: S08GT
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 36
• Operating Supply Voltage: 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: M68EVB908GB60E, M68DEMO908GB60E
• Minimum Operating Temperature: - 40 C
• For Use With: M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Internal Clock Generator (S08ICGV4)
The following sections contain initialization examples for various configurations.
Important configuration information is repeated here for reference.
1
144
1
SCM — self-clocked mode (FLL bypassed
internal)
FBE — FLL bypassed external
FEI — FLL engaged internal
FEE — FLL engaged external
Ensure that
MFD Value
The IRG typically consumes 100 µA. The FLL and DCO typically consumes 0.5 to 2.5 mA, depending upon output frequency.
For minimum power consumption and minimum jitter, choose N and R to be as small as possible.
Bypassed
Engaged
FLL
FLL
000
001
010
011
100
f
ICGDCLK
Clock Scheme
Hexadecimal values designated by a preceding $, binary values designated
by a preceding %, and decimal values have no preceding character.
FEI
4 MHz < f
Medium power (will be less than FEE if oscillator
range = high)
Good clock accuracy (After IRG is trimmed)
Lowest system cost (no external components
required)
IRG is on. DCO is on.
SCM
This mode is mainly provided for quick and reliable
system startup.
3 MHz < f
3 MHz < f
Medium power
Poor accuracy.
IRG is off. DCO is on and open loop.
Multiplication Factor (N)
, which is equal to
Clock Reference Source = Internal
Bus
Bus
Bus
< 20 MHz.
< 5 MHz (default).
< 20 MHz (via filter bits).
Table 9-11. ICGOUT Frequency Calculation Options
10
12
4
6
8
Table 9-10. ICG Configuration Consideration
Table 9-12. MFD and RFD Decode Table
1
MC9S08GT16A/GT8A Data Sheet, Rev. 1
f
ICGOUT
(f
IRG
* R, does not exceed f
f
ext
f
ICGDCLK
/ 7)* 64 * N / R
f
ICGOUT
f
* P * N / R
ext
NOTE
/ R
/ R
1
FEE
4 MHz < f
Medium power (will be less than FEI if oscillator
range = low)
High clock accuracy
Medium/High system cost (crystal, resonator or
external clock source required)
IRG is off. DCO is on.
FBE
f
used.
Lowest power
Highest clock accuracy
Medium/High system cost (Crystal, resonator or
external clock source required)
IRG is off. DCO is off.
RFD
Bus
000
001
010
011
100
Range = 0 ; P = 64
Range = 1; P = 1
ICGDCLKmax
range ≤ 8 MHz when crystal or resonator is
Clock Reference Source = External
Bus
NA
NA
64
P
< 20 MHz
.
Division Factor (R)
Typical f
immediately after reset
Typical f
Freescale Semiconductor
÷16
÷1
÷2
÷4
÷8
ICGOUT
IRG
Note
= 243 kHz
= 8 MHz