MC9S08GT16ACFBE Freescale Semiconductor, MC9S08GT16ACFBE Datasheet - Page 285

• Manufacturer Part Number: MC9S08GT16ACFBE
• Description: IC MCU 16K FLASH 2K RAM 44-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08GT16ACFBE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 2KB
• # I/os (max): 36
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: PQFP
• Processor Series: S08GT
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 36
• Operating Supply Voltage: 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: M68EVB908GB60E, M68DEMO908GB60E
• Minimum Operating Temperature: - 40 C
• For Use With: M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Appendix B
Ordering Information and Mechanical Drawings
B.1
This section contains ordering information for MC9S08GT16A and MC9S08GT8A devices.
B.1.1
B.2
The following pages are mechanical specifications for MC9S08GT16A/GT8A package options. See
Table B-1
Freescale Semiconductor
(MC = Fully Qualified)
Pin Count
Ordering Information
Mechanical Drawings
for the document number for each package type.
Family/memory size
(9 = FLASH-based)
Device Numbering Scheme
48
44
42
32
Memory
Status
PSDIP
Core
QFN
QFP
QFN
1
Table 15-7. Devices in the MC9S08GT16A/GT8A Series
See
MC9S08GT16A
MC9S08GT8A
Table B-1
Device
MC
Quad flat no-lead
Quad flat package
Plastic shrink dual inline package
Quad flat no-lead
MC9S08GT16A/GT8A Data Sheet, Rev. 1
9 S08 GT16A
Table B-1. Package Information
for package information.
Type
FLASH
C
16K
8K
XX
E
RAM
2K
1K
Temperature range
Package designator (see
RoHS compliance indicator (E = yes)
Designator
Packages
42 SDIP
48 QFN
32 QFN
44 QFP
FD
FC
FB
B
(C = –40°C to +85°C)
(M = –40°C to +125°C)
1
Table
Document No.
98ARH99048A
98ARH99035A
98ASB42839B
98ASB42767B
B-1)
285