DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 541

• Manufacturer Part Number: DF2317VTE25
• Description: MCU 3V 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2317VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2317VTE25; HD64F2317VTE25

Bit 6—Block Transfer Mode (BLK): Selects block transfer mode.
Bit 6
BLK
0
1
Note: etu: Elementary time unit (time for transfer of 1 bit)
Bits 3 and 2—Base Clock Pulse 1 and 2 (BCP1, BCP0): These bits specify the number of base
clock periods in a 1-bit transfer interval on the smart card interface.
Bit 3
BCP1
0
1
Bits 5, 4, 1, and 0—Operate in the same way as for the normal SCI. For details, see section
12.2.5, Serial Mode Register (SMR).
Description
Normal smart card interface mode operation
•
•
•
Block transfer mode operation
•
•
•
Bit 2
BCP0
0
1
0
1
Error signal transmission/detection and automatic data retransmission performed
TXI interrupt generated by TEND flag
TEND flag set 12.5 etu after start of transmission (11.0 etu in GSM mode)
Error signal transmission/detection and automatic data retransmission not
performed
TXI interrupt generated by TDRE flag
TEND flag set 11.5 etu after start of transmission (11.0 etu in GSM mode)
Description
32 clock periods
64 clock periods
372 clock periods
256 clock periods
Rev.7.00 Feb. 14, 2007 page 507 of 1108
Section 13 Smart Card Interface
REJ09B0089-0700
(Initial value)
(Initial value)