DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 855

• Manufacturer Part Number: DF2317VTE25
• Description: MCU 3V 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2317VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2317VTE25; HD64F2317VTE25

(1) Clock Timing
Table 20.4 Clock Timing
Condition A: V
Condition B: V
Item
Clock cycle time
Clock pulse high width
Clock pulse low width
Clock rise time
Clock fall time
Reset oscillation stabilization
time (crystal)
Software standby oscillation
stabilization time (crystal)
External clock output
stabilization delay time
0 V, φ = 2 MHz to 20 MHz, T
T
0 V, φ = 2 MHz to 25 MHz, T
T
a
a
CC
CC
= –40°C to 85°C (wide-range specifications)
= –40°C to 85°C (wide-range specifications)
= 2.7 V to 3.6 V, AV
= 3.0 V to 3.6 V, AV
Symbol
t
t
t
t
t
t
t
t
cyc
CH
CL
Cr
Cf
OSC1
OSC2
DEXT
CC
CC
= 2.7 V to 3.6 V, V
= 3.0 V to 3.6 V, V
a
a
Min
50
20
20
—
—
10
10
500
= –20°C to 75°C (regular specifications),
= –20°C to 75°C (regular specifications),
Condition A
—
—
Max
500
—
5
5
—
—
Rev.7.00 Feb. 14, 2007 page 821 of 1108
Section 20 Electrical Characteristics
ref
ref
Min
40
15
15
—
—
10
10
500
Condition B
= 2.7 V to AV
= 3.0 V to AV
Max
500
—
—
5
5
—
—
—
Unit
ns
ns
ns
ns
ns
ms
ms
μs
CC
CC
REJ09B0089-0700
, V
, V
SS
SS
Test
Conditions
Figure 20.2
Figure 20.3
Figure 20.3
= AV
= AV
SS
SS
=
=