DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 789

• Manufacturer Part Number: DF2317VTE25
• Description: MCU 3V 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2317VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2317VTE25; HD64F2317VTE25

Bit-Rate-Adjustment State
The bit rate is calculated by measuring the period of transfer of a low-level byte (H'00) from the
host. The bit rate can be changed by the command for a new bit rate selection. After the bit rate
has been adjusted, the boot program enters the inquiry and selection state. The bit-rate-adjustment
sequence is shown in figure 17.83.
Programming/erasing
Operations for Erasing
User MATs and User
selection wait
Transition to
Programming/erasing
Boot MATs
Programming
Operations for
Bit-Rate-Adjustment
Programming
Inquiry/Selection
Figure 17.82 Boot Program States
State
wait
Reset
Inquiry
Erasing
Operations for
Operations for
Inquiry
Erasing
Rev.7.00 Feb. 14, 2007 page 755 of 1108
Selection
Checking
Operations for
Operations for
Selection
Checking
REJ09B0089-0700
Section 17 ROM