DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 642
DF3026X25V
Manufacturer Part Number
DF3026X25V
Description
MCU 3V 256K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3026X25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3026X25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 20 Power-Down State
20.5
20.5.1
Regardless of its current state, the chip enters hardware standby mode whenever the
goes low. Hardware standby mode reduces power consumption drastically by halting all functions
of the CPU, and on-chip supporting modules. All modules are reset except the on-chip RAM. As
long as the specified voltage is supplied, on-chip RAM data is retained. I/O ports are placed in the
high-impedance state.
Clear the RAME bit to 0 in SYSCR before
The inputs at the mode pins (MD2 to MD0) should not be changed during hardware standby
mode.
20.5.2
Hardware standby mode is exited by inputs at the
S T B Y
clock oscillator to settle. When
transition to the program execution state.
Rev. 2.00 Sep 20, 2005 page 602 of 800
REJ09B0260-0200
goes high, the clock oscillator starts running.
Hardware Standby Mode
Transition to Hardware Standby Mode
Exit from Hardware Standby Mode
R E S
goes high, reset exception handling begins, followed by a
S T B Y
S T B Y
goes low to retain on-chip RAM data.
R E S
and
should be held low long enough for the
R E S
pins. While
R E S
is low, when
S T B Y
pin
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