SAK-XC2237M-104F40L Infineon Technologies, SAK-XC2237M-104F40L Datasheet - Page 101

no-image

SAK-XC2237M-104F40L

Manufacturer Part Number
SAK-XC2237M-104F40L
Description
IC MCU 16BIT 320KB FLASH 64LQFP
Manufacturer
Infineon Technologies
Series
XC22xxMr
Datasheet

Specifications of SAK-XC2237M-104F40L

Core Processor
C166SV2
Core Size
16/32-Bit
Speed
40MHz
Connectivity
CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
38
Program Memory Size
832KB (832K x 8)
Program Memory Type
FLASH
Ram Size
50K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-LFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SAK-XC2237M-104F40L
Manufacturer:
Infineon Technologies
Quantity:
10 000
5.2
When operating the XC223xM in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance
power dissipation must be limited so that the average junction temperature does not
exceed 125 °C.
The difference between junction temperature and ambient temperature is determined by
ΔT = (
The internal power consumption is defined as
P
The static external power consumption caused by the output drivers is defined as
P
The dynamic external power consumption caused by the output drivers (
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
Data Sheet
INT
IOSTAT
Reduce
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
=
P
V
INT
= Σ((
DDP
+
Thermal Considerations
V
×
V
P
DDP
I
DDP
IOSTAT
DDP
, if possible in the system
-
V
(switching current and leakage current).
OH
+
) ×
P
IODYN
I
OH
) + Σ(
) ×
R
ΘJA
V
OL
×
I
OL
XC2000 Family Derivatives / Base Line
101
)
R
ΘJA
” quantifies these parameters. The
Package and Reliability
XC2238M, XC2239M
P
IODYN
V2.0, 2009-03
) depends

Related parts for SAK-XC2237M-104F40L