SAK-XC2237M-104F40L Infineon Technologies, SAK-XC2237M-104F40L Datasheet - Page 23

• Manufacturer Part Number: SAK-XC2237M-104F40L
• Description: IC MCU 16BIT 320KB FLASH 64LQFP
• Manufacturer: Infineon Technologies
• Series: XC22xxMr

Specifications of SAK-XC2237M-104F40L

• Core Processor: C166SV2
• Core Size: 16/32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
• Peripherals: I²S, POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 832KB (832K x 8)
• Program Memory Type: FLASH
• Ram Size: 50K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 64-LFQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 5
Pin
63
6
24,
41,
57
9
2,
16,
18,
32,
34,
48,
50,
64
1,
17,
33,
49
Data Sheet
Symbol
ESR0
U1C0_DX0E
U1C0_DX2B
V
V
V
V
V
DDIM
DDI1
DDPA
DDPB
SS
Pin Definitions and Functions (cont’d)
Ctrl.
O0 / I St/B
I
I
-
-
-
-
-
Type Function
St/B
St/B
PS/M Digital Core Supply Voltage for Domain M
PS/1 Digital Core Supply Voltage for Domain 1
PS/A Digital Pad Supply Voltage for Domain A
PS/B Digital Pad Supply Voltage for Domain B
PS/-- Digital Ground
External Service Request 0
Note: After power-up, ESR0 operates as open-
USIC1 Channel 0 Shift Data Input
USIC1 Channel 0 Shift Control Input
Decouple with a ceramic capacitor, see
for details.
Decouple with a ceramic capacitor, see
for details.
All
Connect decoupling capacitors to adjacent
V
Note: The A/D_Converters and ports P5, P6 and
Connect decoupling capacitors to adjacent
V
Note: The on-chip voltage regulators and all ports
All
or ground-plane.
Note: Also the exposed pad is connected
SS
SS
V
V
pin pairs as close as possible to the pins.
pin pairs as close as possible to the pins.
DDI1
SS
XC2000 Family Derivatives / Base Line
23
drain bidirectional reset with a weak pull-up.
P15 are fed from supply voltage
except P5, P6 and P15 are fed from supply
voltage
internally to
behavior, it is recommended to connect the
exposed pad to the board ground.
For thermal aspects, please refer to
Section
given in an application note.
pins must be connected to the ground-line
pins must be connected to each other.
V
5.1. Board layout examples are
DDPB
.
V
General Device Information
SS
. To improve the EMC
XC2238M, XC2239M
V2.0, 2009-03
V
Table 13
Table 13
DDPA
V
V
.
DDP
DDP
/
/