SAK-XC2237M-104F40L Infineon Technologies, SAK-XC2237M-104F40L Datasheet - Page 99

• Manufacturer Part Number: SAK-XC2237M-104F40L
• Description: IC MCU 16BIT 320KB FLASH 64LQFP
• Manufacturer: Infineon Technologies
• Series: XC22xxMr

Specifications of SAK-XC2237M-104F40L

• Core Processor: C166SV2
• Core Size: 16/32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
• Peripherals: I²S, POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 832KB (832K x 8)
• Program Memory Type: FLASH
• Ram Size: 50K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 64-LFQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

5
In addition to the electrical parameters, the following specifications ensure proper
integration of the XC223xM into the target system.
5.1
These parameters specify the packaging rather than the silicon.
Table 35
Parameter
Power Dissipation
Thermal resistance
Junction-Ambient
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) or a 4-layer board without thermal vias;
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias.
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
Package Compatibility Considerations
The XC223xM is a member of the XC2000 Family of microcontrollers. It is also
compatible to a certain extent with members of similar series and subfamilies.
Each package is optimized for the chip it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the Exposed Pad (if present) may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
Data Sheet
exposed pad not soldered.
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package and Reliability
Packaging
Package Parameters (PG-LQFP-64-13)
Symbol
P
R
DISS
ΘJA
Min.
–
–
XC2000 Family Derivatives / Base Line
99
Limit Values
Max.
1.0
58
46
Package and Reliability
XC2238M, XC2239M
Unit Notes
W
K/W No thermal via
K/W 4-layer, no pad
–
V2.0, 2009-03
1)
2)