SAK-XC2237M-104F40L Infineon Technologies, SAK-XC2237M-104F40L Datasheet - Page 94

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SAK-XC2237M-104F40L

Manufacturer Part Number
SAK-XC2237M-104F40L
Description
IC MCU 16BIT 320KB FLASH 64LQFP
Manufacturer
Infineon Technologies
Series
XC22xxMr
Datasheet

Specifications of SAK-XC2237M-104F40L

Core Processor
C166SV2
Core Size
16/32-Bit
Speed
40MHz
Connectivity
CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
38
Program Memory Size
832KB (832K x 8)
Program Memory Type
FLASH
Ram Size
50K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-LFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SAK-XC2237M-104F40L
Manufacturer:
Infineon Technologies
Quantity:
10 000
Table 32
Parameter
TCK clock period
TCK high time
TCK low time
TCK clock rise time
TCK clock fall time
TDI/TMS setup
to TCK rising edge
TDI/TMS hold
after TCK rising edge
TDO valid
after TCK falling edge
TDO high imped. to valid
from TCK falling edge
TDO valid to high imped.
from TCK falling edge
TDO hold after
TCK falling edge
1) The falling edge on TCK is used to generate the TDO timing.
2) The setup time for TDO is given implicitly by the TCK cycle time.
3) The setup time for TDO is given implicitly by the TCK cycle time.
Figure 22
Data Sheet
0.5
V
DDP
JTAG Interface Timing Parameters for Lower Voltage Range
Test Clock Timing (TCK)
1)
1)
2)3)
1)
t
2
Symbol
t
t
t
t
t
t
t
t
t
t
t
1
2
3
4
5
6
7
8
9
10
18
t
1
SR
SR
SR
SR
SR
SR
SR
CC
CC
CC
CC
t
3
Min.
50
16
16
6
6
5
XC2000 Family Derivatives / Base Line
94
Values
Typ.
32
32
32
t
5
Max.
8
8
36
36
36
XC2238M, XC2239M
Unit Note /
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Electrical Parameters
t
4
Test Condition
MC_JTAG_TCK
V2.0, 2009-03
0.9
0.1
V
V
DDP
DDP

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