M5275EVBE Freescale Semiconductor, M5275EVBE Datasheet - Page 17

• Manufacturer Part Number: M5275EVBE
• Description: MCF5274/75 EVALUATION BO
• Manufacturer: Freescale Semiconductor
• Series: ColdFire®r
• Type: Microprocessorr

Specifications of M5275EVBE

• Contents: Module and Misc Hardware
• Silicon Manufacturer: Freescale
• Core Architecture: Coldfire
• Core Sub-architecture: Coldfire V2
• Silicon Core Number: MCF52
• Silicon Family Name: MCF527x
• Rohs Compliant: Yes
• For Use With/related Products: MCF5274, MCF5275
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

6.4
Figure 6
Freescale Semiconductor
196X
13X
3
e
X
E
Y
b
0.15
0.08 Z
shows MCF5275 196 MAPBGA package dimensions.
S
Package Dimensions - 196 MAPBGA
TOL
Z
14 13 12 11
X
Y
Laser mark for pin 1
identification in
this area
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
10 9
View M-M
D
Figure 6. 196 MAPBGA Package Dimensions
6
13X
S
5 4
e
3 2
1
M
C
D
G
H
N
A
B
E
F
J
K
L
P
Metalized mark for
pin 1 identification
in this area
K
M
M
A
A2
A1
Rotated 90° Clockwise
NOTES:
1.
2.
3.
4.
5.
Z
Dimensions are in millimeters.
Interpret dimensions and tolerances
per ASME Y14.5M, 1994.
Dimension b is measured at the
maximum solder ball diameter,
parallel to datum plane Z.
Datum Z (seating plane) is defined
by the spherical crowns of the solder
balls.
Parallelism measurement shall
exclude any effect of mark on top
surface of package.
DIM
A1
A2
Detail K
A
D
b
E
e
S
4
Min
1.25
0.27
0.45
Millimeters
15.00 BSC
15.00 BSC
1.00 BSC
0.50 BSC
1.16 REF
196X
Mechanicals/Pinouts
0.10 Z
Max
1.60
0.47
0.55
5
0.20 Z
17