M5275EVBE Freescale Semiconductor, M5275EVBE Datasheet - Page 3

• Manufacturer Part Number: M5275EVBE
• Description: MCF5274/75 EVALUATION BO
• Manufacturer: Freescale Semiconductor
• Series: ColdFire®r
• Type: Microprocessorr

Specifications of M5275EVBE

• Contents: Module and Misc Hardware
• Silicon Manufacturer: Freescale
• Core Architecture: Coldfire
• Core Sub-architecture: Coldfire V2
• Silicon Core Number: MCF52
• Silicon Family Name: MCF527x
• Rohs Compliant: Yes
• For Use With/related Products: MCF5274, MCF5275
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2
The superset device in the MCF5275 family comes in a 256 Mold Array Plastic Ball Grid Array
(MAPBGA) package.
3
For a detailed feature list see the MCF5275 Reference Manual (MCF5275RM).
Freescale Semiconductor
(To/From PADI)
(To/From PADI)
(To/From
JTAG
(To/From
TAP
PADI)
MDHA
PADI)
(To/From PADI)
Cryptography
Block Diagram
Features
Modules
RNGA
JTAG_EN
FAST ETHERNET
DREQ[1:0]
FAST ETHERNET
CONTROLLER
CONTROLLER
(FEC1)
(FEC0)
4 CH DMA
4 CH PWM
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
SKHA
Watchdog
Timer
Figure 1
DACK[3:0]
(To/From PADI)
Full Speed
USB 2.0
shows a top-level block diagram of the MCF5275, the superset device.
(To/From SRAM backdoor)
Figure 1. MCF5275 Block Diagram
Arbiter
(To/From INTC)
UART
(To/From Arbiter backdoor)
Edge
0
Port
DTIM
0
UART
(8Kx16)x4
64 Kbytes
1
SRAM
CLKGEN
V2 ColdFire CPU
DTIM
PLL
1
UART
DIV
2
INTC0
DTIM
2
I
2
16 Kbytes
(1Kx32)x4
C
PIT0
CACHE
EMAC
INTC1
DTIM
3
QSPI
PIT1
SELECTS
CHIP
PORTS
SDRAMC
(GPIO)
EIM
EBI
PIT2
CIM
Block Diagram
PIT3
D[31:16]
A[23:0]
TA
DDR
QSPI
I2C_SDA
TXDx
DTOUTx
PWMx
R/W
CS[3:0]
I2C_SCL
RXDx
DTINx
FEC0
FEC1
TRST
TSIZ[1:0]
BS[3:2]
RTSx
CTSx
USB
JTAG_EN
TMS
TDI
TEA
TCLK
TDO
3