M5275EVBE Freescale Semiconductor, M5275EVBE Datasheet - Page 7

• Manufacturer Part Number: M5275EVBE
• Description: MCF5274/75 EVALUATION BO
• Manufacturer: Freescale Semiconductor
• Series: ColdFire®r
• Type: Microprocessorr

Specifications of M5275EVBE

• Contents: Module and Misc Hardware
• Silicon Manufacturer: Freescale
• Core Architecture: Coldfire
• Core Sub-architecture: Coldfire V2
• Silicon Core Number: MCF52
• Silicon Family Name: MCF527x
• Rohs Compliant: Yes
• For Use With/related Products: MCF5274, MCF5275
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Freescale Semiconductor
QSPI_CS[3:2]
Signal Name
USB_SPEED
QSPI_DOUT
DACK[3:0] and DREQ[3:0] do not have a dedicated bond pads.
DACK1, TSIZ0 for DACK0, IRQ3 for DREQ3, IRQ2 and TA for
QSPI_CS1
QSPI_CS0
QSPI_CLK
PCS3/PWM3 for DACK3, PCS2/PWM2 for DACK2, TSIZ1 for
QSPI_DIN
USB_CLK
I2C_SDA
I2C_SCL
U2RXD
U1RXD
U0RXD
U2TXD
U2CTS
U2RTS
U1TXD
U1CTS
U1RTS
U0TXD
U0CTS
U0RTS
Table 2. MCF5274 and MCF5275 Signal Information and Muxing (continued)
DREQ2, TEA for DREQ1, and TIP for DREQ0.
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
Please refer to the following pins for muxing:
PFECI2C[1]
PFECI2C[0]
PUARTH[3]
PUARTH[2]
PUARTH[1]
PUARTH[0]
PQSPI[6:5]
PUARTL[7]
PUARTL[6]
PUARTL[5]
PUARTL[4]
PUARTL[3]
PUARTL[2]
PUARTL[1]
PUARTL[0]
PUSBH[0]
PUSBL[7]
PQSPI[4]
PQSPI[3]
PQSPI[2]
PQSPI[1]
PQSPI[0]
GPIO
Alternate1
PWM[3:2]
I2C_SDA
I2C_SCL
U2RXD
U2TXD
PWM1
PWM0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
UARTs
DMA
QSPI
USB
I
Alternate2 Dir.
DACK[3:2]
2
C
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
I/O
I/O
I/O
O
O
O
O
O
O
O
O
O
O
O
I
I
I
I
I
I
I
I
1
256 MAPBGA
MCF5274
MCF5275
R13, N12
G14
G15
B10
C10
T14
P12
T15
T13
R12
R9
P9
R8
A9
B9
C9
D9
A8
B8
C8
D7
T9
—
196 MAPBGA
MCF5274L
MCF5275L
P10, N9
M10
N10
G11
L11
L10
F12
M9
D7
C7
C6
B7
A7
A6
B6
A4
A5
B5
—
—
—
—
—
Signal Descriptions
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