MPC8536BVTATH Freescale Semiconductor, MPC8536BVTATH Datasheet - Page 111

• Manufacturer Part Number: MPC8536BVTATH
• Description: Microprocessors (MPU) 8536 INDUSTRIAL 1250
• Manufacturer: Freescale Semiconductor

Specifications of MPC8536BVTATH

• Processor Series: MPC85xx
• Core: e500
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 1250 MHz
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: 0 C
• Package / Case: FCPBGA-783
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Thermal
Figure 72. System Level Thermal Model for MPC8535E (Not to Scale)
The Flotherm library files of the parts have a dense grid to accurately capture the laminar boundary layer for flow over the part
in standard JEDEC environments, as well as the heat spreading in the board under the package. In a real system, however, the
part will require a heat sink to be mounted on it. In this case, the predominant heat flow path will be from the die to the heat
sink. Grid density lower than currently in the package library file will suffice for these simulations. The user will need to
determine the optimal grid for their specific case.
2.24.3
Thermal Management Information
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow,
and thermal interface material.
MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 3
Freescale Semiconductor
111