MC33696MOD434EV Freescale Semiconductor, MC33696MOD434EV Datasheet - Page 56

MCU, MPU & DSP Development Tools MC33696 (ECHO) RF C EVAL

MC33696MOD434EV

Manufacturer Part Number
MC33696MOD434EV
Description
MCU, MPU & DSP Development Tools MC33696 (ECHO) RF C EVAL
Manufacturer
Freescale Semiconductor
Datasheets

Specifications of MC33696MOD434EV

Processor To Be Evaluated
MC9S08RG60
Interface Type
RS-232
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Application Schematics
20
20.1 PCB Design Recommendations
Pay attention to the following points and recommendations when designing the layout of the PCB.
56
SMA Vert
J1
Ground Plane
— If you can afford a multilayer PCB, use an internal layer for the ground plane, route power
— Use at least a double-sided PCB.
— Use a large ground plane on the opposite layer.
— If the ground plane must be cut on the opposite layer for routing some signals, maintain
Application Schematics
supply and digital signals on the last layer, RF components being located on the first layer.
continuity with another ground plane on the opposite layer and a lot of via to minimize
C39
L7
C36
C40
C28
VCCINOUT
L10
Figure 47. MC33696 Application Schematic (5 V)
C6
C22
C20
VCC2
VCC2
MC33696 Data Sheet, Rev. 9
SWITCH
1
2
3
4
5
6
7
8
RSSIOUT
VCC2RF
RFIN
GNDLNA
VCC2VCO
GNDPA1
RFOUT
GNDPA2
C35
X1
C24
C7
C29
VCC2
1 nF
C3
MC33696
U4
VCC2
C31
C30
R13
DATACLK
GNDDIG
CONFB
RSSIC
SCLK
MOSI
MISO
SEB
C8
Freescale Semiconductor
24
23
22
21
20
19
18
17
RSSIOUT
STROBE
5 V
GND
SEB
SCLK
MOSI
MISO
CONFB
DATACLK
RSSIC

Related parts for MC33696MOD434EV