MC33696MOD434EV Freescale Semiconductor, MC33696MOD434EV Datasheet - Page 57

• Manufacturer Part Number: MC33696MOD434EV
• Description: MCU, MPU & DSP Development Tools MC33696 (ECHO) RF C EVAL
• Manufacturer: Freescale Semiconductor

Specifications of MC33696MOD434EV

• Processor To Be Evaluated: MC9S08RG60
• Interface Type: RS-232
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Freescale Semiconductor
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Power Supply, Ground Connection and Decoupling
— Connect each ground pin to the ground plane using a separate via for each signal; do not use
— Place each decoupling capacitor as close to the corresponding VCC pin as possible (no more
— Locate the VCCDIG2 decoupling capacitor (C13) directly between VCCDIG2 (pin 14) and
— GNDPA1 and GNDPA2 inductance to ground should be minimum. If possible, use two via for
RF Tracks, Matching Network and Other Components
— Minimize any tracks used for routing RF signals.
— Locate crystal X1 and associated capacitors C15 and C11 close to the MC33696. Avoid loops
— Use high frequency coils with high Q values for the frequency of operation (minimum of 15).
— Track between RFOUT and RFIN should be as short as possible to minimize lost in TX mode.
parasitic inductance.
common vias.
than 2–3 mm away).
GND (pin 16).
each pin.
occurring due to component size and tracks. Avoid routing digital signals in this area.
Validate any change of coil source.
The values indicated for the matching network have been computed and
tuned for the the MC33696 RF Modules available for MC33696 evaluation.
Matching networks should be retuned if any change is made to the PCB
(track width, length or place, or PCB thickness, or component value). Never
use, as is, a matching network designed for another PCB.
MC33696 Data Sheet, Rev. 9
NOTE
Application Schematics
57