LAN89218AQ_samples SMSC, LAN89218AQ_samples Datasheet - Page 145

• Manufacturer Part Number: LAN89218AQ_samples
• Description: Ethernet ICs High Perform Chip 10/100 NonPCI Cntrl
• Manufacturer: SMSC

Specifications of LAN89218AQ_samples

• Ethernet Connection Type: 10BASE-T, 100BASE-TX
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Product: Ethernet Controllers
• Standard Supported: IEEE802.3, IEEE802.3u
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Maximum Operating Temperature: + 85 C
• Package / Case: TQFP-100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

High Performance Single-Chip 10/100 Ethernet Controller for Automotive Applications
Datasheet
Chapter 7 Operational Characteristics
SMSC LAN89218
7.1
7.2
7.3
Thermal Resistance
Junction-to-Top-of-Package
PARAMETER
Specifications are subject to change without notice.
Supply Voltage (VDD_A, VDD_REF, VREG, VDD_IO) . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to +3.6 V
Positive voltage on signal pins, with respect to ground
Negative voltage on signal pins, with respect to ground
Positive voltage on XTAL1/CLKIN, with respect to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+4.6 V
Positive voltage on XTAL2, with respect to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+2.5 V
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..-65
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+150
Lead Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to JEDEC Spec. J-STD-020
*Operation at or above these limits may damage the device.
Note 7.1 This rating does not apply to the following pins: XTAL1/CLKIN, XTAL2, EXRES1.
Note 7.2 This rating does not apply to the following pins: EXRES1.
Supply Voltage (VDD_A, VDD_REF, VREG, VDD_IO) . . . . . . . . . . . . . . . . . . . . . . . . .+3.3 V ± 300 mV
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
**Proper operation of the LAN89218 is guaranteed only within the ranges specified in this section.
Note: Thermal parameters are measured or estimated for devices in a multilayer 2S2P PCB per
Absolute Maximum Ratings*
Operating Conditions**
Package Thermal Specifications
JESD51.
SYMBOL
Θ
Ψ
Table 7.1 Package Thermal Parameters
JA
JT
DATASHEET
VALUE
1.25
35
145
UNITS
o
o
C/W
C/W
(Note
(Note
7.1) . . . . . . . . . . . . . . . . . . . . . . . .+6.0 V
7.2) . . . . . . . . . . . . . . . . . . . . . . . -0.5 V
Measured from the die to ambient air.
COMMENTS
Revision 1.3 (02-23-10)
o
o
C to +150
C to +125
o
o
o
C
C
C