S25FL032P0XMFI011 Spansion Inc., S25FL032P0XMFI011 Datasheet - Page 67

• Manufacturer Part Number: S25FL032P0XMFI011
• Description: IC 32M CMOS 3V 104MHZ SPI BUS INTERFACE
• Manufacturer: Spansion Inc.

Specifications of S25FL032P0XMFI011

• Cell Type: NOR
• Density: 32Mb
• Access Time (max): 8ns
• Interface Type: Serial (SPI)
• Boot Type: Bottom/Top
• Address Bus: 1b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: SOIC W
• Sync/async: Synchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 4M
• Supply Current: 38mA
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / Rohs Status: Compliant

October 5, 2009 S25FL032P_00_05
Release from Deep Power-Down (RES) Added note for RES command
OTP Regions
Operating Ranges
AC Characteristics
Physical Dimensions
Revision 05 (October 5, 2009)
Global
Connection Diagrams
Ordering Information
Valid Combinations
Physical Dimensions
AC Characteristics
Section
Updated descriptions
Added ESN1 and ESN2 Table
Added Automotive In-cabin temperature range
Added Automotive In-cabin spec for f
Updated t
Added BGA 6 x 8 mm package
Changed all references to RDID clock rate from 40 to 50 MHz
Added “5 x 5 pin configuration” to Figure 2.5 title
Added 6 x 4 pin configuration BGA connection diagram
Added note regarding exposed central pad on bottom of package to the WSON and USON
connection diagram.
Added Automotive In-Cabin temperature valid combinations for BGA packages.
Added 02 and 03 model numbers for BGA packages
Removed BGA from 00 model number description
Added Low-Halogen material option
Changed valid BGA model number combinations to 02 and 03
Changed valid BGA material option to Low-Halogen
Removed Note 1
Added FAC024 BGA package
Removed 76 MHz Automotive in-cabin spec from f
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