MT45W512KW16PGA-70 WT Micron Technology Inc, MT45W512KW16PGA-70 WT Datasheet - Page 24

• Manufacturer Part Number: MT45W512KW16PGA-70 WT
• Manufacturer: Micron Technology Inc

Specifications of MT45W512KW16PGA-70 WT

• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Compliant

Package Dimensions
Figure 24:
PDF: 09005aef8220472e/Source: 09005aef8220461e
8mb_asyncpage_ps1_0_p23z.fm - Rev. A 7/06 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
SEATING
PLANE
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW.
PRE-REFLOW BALL
DIAMETER IS 0.35
ON A 0.30 SMD
BALL PAD.
0.10 A
5.25
48X Ø0.37
BALL A6
48-Ball VFBGA
2.625
0.70 ±0.05
Advance: This data sheet contains initial descriptions of products still under development.
A
Notes:
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. The MT45W512KW16P uses “green” packaging.
1. All dimensions in millimeters, MAX/MIN or typical where noted.
1.875
0.25mm per side.
6.00 ±0.10
0.75
TYP
3.75
C L
3.00 ±0.05
their respective owners.
0.75 TYP
C L
4.00 ±0.05
BALL A1
BALL A1 ID
24
8.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
8Mb: 512K x 16 Async/Page PSRAM
1.00 MAX
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
96.5% Sn, 3% Ag, 0.5% Cu
Package Dimensions
©2006 Micron Technology, Inc. All rights reserved.
BALL A1 ID
Advance