MC9S08GT32ACFDE Freescale, MC9S08GT32ACFDE Datasheet - Page 54

MC9S08GT32ACFDE

Manufacturer Part Number
MC9S08GT32ACFDE
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S08GT32ACFDE

Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
40MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
2KB
# I/os (max)
39
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8/2.08V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Package Type
QFN EP
Program Memory Type
Flash
Program Memory Size
32KB
Lead Free Status / RoHS Status
Compliant
Chapter 4 Memory
program time provided that the conditions above are met. In the case the next sequential address is the
beginning of a new row, the program time for that byte will be the standard time instead of the burst time.
This is because the high voltage to the array must be disabled and then enabled again. If a new burst
command has not been queued before the current command completes, then the charge pump will be
disabled and high voltage removed from the array.
54
YES
Figure 4-3. Flash Burst Program Flowchart
0
TO BUFFER ADDRESS AND DATA
WRITE COMMAND TO FCMD
NEW BURST COMMAND ?
TO LAUNCH COMMAND
MC9S08GB60A Data Sheet, Rev. 2
AND CLEAR FCBEF
WRITE 1 TO FCBEF
WRITE TO FCDIV
WRITE TO FLASH
CLEAR ERROR
FACCERR ?
FACCERR ?
FPVIO OR
FCBEF ?
FCCF ?
START
DONE
1
NO
NO
1
1
(1)
(2)
0
0
YES
(2)
checking FCBEF or FCCF.
(1)
Wait at least four bus cycles before
after reset.
Only required once
ERROR EXIT
Freescale Semiconductor

Related parts for MC9S08GT32ACFDE